⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Isoxazole SCHEMBL393230 | 0.96 | — | — | |
| Isoxazole SCHEMBL1318 | 0.96 | — | — | |
| Isoxazole SCHEMBL2679369 | 0.96 | PARP1 (1.00) | — | |
| Isoxazole SCHEMBL31018965 | 0.93 | — | — | |
| Isoxazole SCHEMBL21448373 | 0.93 | — | — | |
| Isoxazole SCHEMBL30791001 | 0.93 | — | — | |
| Isoxazole SCHEMBL2106061 | 0.93 | — | — | |
| Isoxazole SCHEMBL1118550 | 0.93 | — | — | |
| Isoxazole SCHEMBL9491120 | 0.93 | — | — | |
| Isoxazole SCHEMBL1798124 | 0.93 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110452235-A | Fluorine isoxazole class compound and preparation method thereof, pharmaceutical composition and purposes | SHANGHAI INST MATERIA MEDICA CAS | 2019-11-15 | — | — | CN | disclosed |
| CN-110452235-A | Fluorine isoxazole class compound and preparation method thereof, pharmaceutical composition and purposes | SHANGHAI INST MATERIA MEDICA CAS | 2019-11-15 | — | — | CN | disclosed |
| CN-110452235-A | Fluorine isoxazole class compound and preparation method thereof, pharmaceutical composition and purposes | SHANGHAI INST MATERIA MEDICA CAS | 2019-11-15 | — | — | CN | disclosed |
| CN-107108565-B | The N- pyridine yl acetamide derivatives of inhibitor as WNT signal transmission approach | 莱德克斯制药公共有限公司 | 2019-08-23 | — | — | CN | disclosed |
| CN-107108565-A | The N pyridine yl acetamide derivatives of the inhibitor of approach are transmitted as WNT signals | 莱德克斯制药公共有限公司 | 2017-08-29 | — | — | CN | disclosed |
| US-8642526-B2 | Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2014-02-04 | — | — | US | disclosed |
| CN-102573458-A | Monoalkyl sulfosuccinates in pesticide formulations and applications as hydrotropes | AKZO NOBEL CHEMICALS INT BV | 2012-07-11 | — | — | CN | disclosed |
| CN-102413695-A | Safener for injury of penoxsulam herbicide in water-sown rice, direct-sown rice and transplanted rice | DOW AGROSCIENCES LLC | 2012-04-11 | — | — | CN | disclosed |
| US-20110275164-A1 | COMPOSITION AND METHOD FOR RECYCLING SEMICONDUCTOR WAFERS HAVING LOW-K DIELECTRIC MATERIALS THEREON | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2011-11-10 | — | — | US | disclosed |
| US-7960328-B2 | for removing low-k dielectric material, etch stop material, and/or metal stack material from rejected microelectronic device; hydrofluoric acid; pollution control, environment friendly | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2011-06-14 | — | — | US | disclosed |
| US-20100112728-A1 | METHODS FOR STRIPPING MATERIAL FOR WAFER RECLAMATION | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2010-05-06 | — | — | US | disclosed |
| EP-1946358-A4 | COMPOSITION AND METHOD FOR RECYCLING SEMICONDUCTOR WAFERS HAVING LOW-K DIELECTRIC MATERIALS THEREON | ADVANCED TECH MATERIALS (US) | 2009-03-04 | — | — | EP | disclosed |
| WO-2008157345-A2 | WAFER RECLAMATION COMPOSITIONS AND METHODS | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-12-24 | — | — | WO | disclosed |
| US-20080261847-A1 | Composition and Method for Recycling Semiconductor Wafers Having Low-K Dielectric Materials Thereon | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-10-23 | — | — | US | disclosed |
| WO-2008121952-A1 | METHODS FOR STRIPPING MATERIAL FOR WAFER RECLAMATION | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-10-09 | — | — | WO | disclosed |
| EP-1975987-A2 | Methods for stripping material for wafer reclamation | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-10-01 | — | — | EP | disclosed |
| EP-1946358-A2 | COMPOSITION AND METHOD FOR RECYCLING SEMICONDUCTOR WAFERS HAVING LOW-K DIELECTRIC MATERIALS THEREON | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-07-23 | — | — | EP | disclosed |
| WO-2007111694-A2 | COMPOSITION AND METHOD FOR RECYCLING SEMICONDUCTOR WAFERS HAVING LOW-K DIELECTRIC MATERIALS THEREON | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2007-10-04 | — | — | WO | disclosed |
| CN-1206358-C | DNA sequence of a gene of hydroxy-phenyl pyruvate dioxygenase and production of plants containing a gene of hydroxy-phenyl pyruvate dioxygenase and which are tolerant to certain herbicides | RHONE POULENC AGROCHIMIE (FR) | 2005-06-15 | — | — | CN | disclosed |
| CN-1192243-A | DNA sequence of hydroxyphenyl pyruvate dioxygenase gene and obtaining of specific herbicide resistant plant containing hydroxyphenyl pyruvate dioxygenase gene | RHONE POULENC AGROCHIMIE (FR) | 1998-09-02 | — | — | CN | disclosed |