SCHEMBL1319366

SCHEMBL1319366

CC(C(=O)OC1CCCCC1)=C(C1CCCCC1)C1CCCCC1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 2/20 0.42
NAAA Q02083 2/20 0.39
CES2 O00748 1/20 0.38
CES1 P23141 1/20 0.38
HTT P42858 1/20 0.38
SMN1; SMN2 Q16637 2/20 0.36
LMNA P02545 1/20 0.36
MAPT P10636 1/20 0.36
NPSR1 Q6W5P4 1/20 0.36
CYP2C19 P33261 1/20 0.36
CA12 O43570 1/20 0.35
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
CA9 Q16790 1/20 0.35
CYP19A1 P11511 3/20 0.34
HDAC8 Q9BY41 1/20 0.33
HDAC6 Q9UBN7 1/20 0.33
HSD11B1 P28845 1/20 0.33
GPR35 Q9HC97 1/20 0.33
RECQL P46063 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL352894 1.00 EPHX1 (0.42) EPHX1NAAACES2CES1HTT
SCHEMBL14777044 1.00 EPHX1 (0.42) EPHX1NAAACES2CES1HTT
SCHEMBL11046873 0.98 EPHX1 (0.41) EPHX1NAAACES2CES1HTT
SCHEMBL14351288 0.98 EPHX1 (0.39) EPHX1NAAACES2CES1HTT
SCHEMBL28106706 0.95 EPHX1 (0.39) EPHX1NAAACES2CES1HTT
Methacrylic Acid SCHEMBL28164389 0.90 EPHX1 (0.36) EPHX1NAAACES2CES1HTT
SCHEMBL22187117 0.87 ALDH1A1 (0.44) EPHX1NAAAHTTSMN1; SMN2LMNA
SCHEMBL5835002 0.85 EPHX1 (0.42) EPHX1NAAACES2CES1HTT
SCHEMBL4133806 0.85 EPHX1 (0.42) EPHX1NAAACES2CES1HTT
SCHEMBL28626881 0.85 EPHX1 (0.42) EPHX1NAAACES2CES1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117897421-A High-energy ray-curable composition and use thereof 陶氏东丽株式会社 2024-04-16 CN disclosed
US-10251265-B2 Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2019-04-02 US disclosed
US-20180098425-A1 PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2018-04-05 US disclosed
US-20110272185-A1 PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-11-10 US disclosed