SCHEMBL1322741

SCHEMBL1322741

CCCCCCCCC(=O)OOC(C)(C)C

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.53
LMNA P02545 2/20 0.50
PAM P19021 2/20 0.48
MAPT P10636 2/20 0.47
MAPK1 P28482 1/20 0.47
CES2 O00748 3/20 0.46
CES1 P23141 3/20 0.46
TSHR P16473 5/20 0.46
PPARG P37231 6/20 0.45
PPARD Q03181 6/20 0.45
PPARA Q07869 6/20 0.45
HDAC11 Q96DB2 5/20 0.45
GPR84 Q9NQS5 4/20 0.45
ALDH1A1 P00352 2/20 0.45
TLR2 O60603 2/20 0.45
TDP1 Q9NUW8 2/20 0.45
FABP4 P15090 2/20 0.45
PTPN1 P18031 2/20 0.45
SLC22A6 Q4U2R8 1/20 0.45
SLC22A8 Q8TCC7 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6005474 1.00 DGKA (0.53) DGKALMNAPAMMAPTMAPK1
SCHEMBL9566585 1.00 DGKA (0.53) DGKALMNAPAMMAPTMAPK1
SCHEMBL1921843 1.00 DGKA (0.53) DGKALMNAPAMMAPTMAPK1
SCHEMBL4817097 1.00 DGKA (0.53) DGKALMNAPAMMAPTMAPK1
SCHEMBL9566601 1.00 DGKA (0.53) DGKALMNAPAMMAPTMAPK1
SCHEMBL9566611 1.00 DGKA (0.53) DGKALMNAPAMMAPTMAPK1
SCHEMBL9142434 1.00 DGKA (0.53) DGKALMNAPAMMAPTMAPK1
SCHEMBL9142557 1.00 DGKA (0.53) DGKALMNAPAMMAPTMAPK1
SCHEMBL81138 1.00 DGKA (0.53) DGKALMNAPAMMAPTMAPK1
SCHEMBL28423892 1.00 DGKA (0.53) DGKALMNAPAMMAPTMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114395067-B Industrial-scale high-performance high-impact polystyrene production device and production process 上海希尔吾新材料科技发展有限公司 2023-12-01 CN claimed
CN-114395067-A Industrial-scale high-performance high-impact polystyrene production device and production process 上海希尔吾新材料科技发展有限公司 2022-04-26 CN claimed
CN-113087827-A Transparent polystyrene with ultraviolet aging resistance and good yellowing resistance and preparation method thereof 惠州仁信新材料股份有限公司 2021-07-09 CN claimed
CN-113072777-A Transparent polystyrene resin with good strength and preparation method thereof 惠州仁信新材料股份有限公司 2021-07-06 CN claimed
CN-112724296-A Transparent polystyrene with capacity of more than 5 ten thousand tons and production equipment and process thereof 江苏可立特工程设计研究有限公司 2021-04-30 CN claimed
CN-112661910-A Impact-resistant polystyrene with capacity of more than 5 ten thousand tons and equipment and production process thereof 江苏可立特工程设计研究有限公司 2021-04-16 CN claimed
CN-1990541-B Crosslinkable compositions, process for their preparation and their use LANXESS DEUTSCHLAND GMBH 2012-06-20 CN claimed
CN-1990541-A Crosslinkable compositions, process for their preparation and their use LANXESS DEUTSCHLAND GMBH (DE) 2007-07-04 CN claimed
CN-1087355-A Composition and method that the preparation synthetic glass is used ENICHEM SINTESI (IT) 1994-06-01 CN claimed
CN-118284651-A Heat insulating sheet, sheet for battery module, and battery module 日本瑞翁株式会社 2024-07-02 CN disclosed
CN-118234377-A Method for improving efficacy of herbicides 巴斯夫欧洲公司 2024-06-21 CN disclosed
CN-114573736-B Method for reducing volatile matter content in poly (methyl) acrylic ester 苏州星日化学有限公司 2024-03-15 CN disclosed
CN-117441259-A Battery module sheet and battery module 日本瑞翁株式会社 2024-01-23 CN disclosed
CN-115850894-B Method for inhibiting degradation of poly (methyl) acrylic ester solution in flash evaporation process 苏州星日化学有限公司 2023-12-08 CN disclosed
US-6162876-A Cyanate ester based thermoset compositions GENERAL ELECTRIC COMPANY (US) 2000-12-19 US disclosed
US-6051662-A POLYPHENYLENE ETHER RESIN COMPONENT HAS A MOLECULAR WEIGHT OF LESS THAN ABOUT 3000 NUMBER AVERAGE IN CONTRAST TO HIGHER POLYPHENYLENE ETHERS EMPLOYED IN OTHER POLYPHENYLENE ETHER-THERMOSETTING RESIN FOR USE IN PRINTED CIRCUIT BOARD GENERAL ELECTRIC CO. (US) 2000-04-18 US disclosed
EP-0962495-A1 A curable polyphenylene ether-thermosetting resin composition GENERAL ELECTRIC COMPANY (US) 1999-12-08 EP disclosed
EP-0945477-A1 Cyanate ester based thermoset compositions GENERAL ELECTRIC COMPANY (US) 1999-09-29 EP disclosed
EP-0921158-A2 Poly(phenylene ether) thermoset compositions GENERAL ELECTRIC COMPANY (US) 1999-06-09 EP disclosed
US-5834565-A FOR PRINTED CIRCUIT BOARDS GENERAL ELECTRIC COMPANY (US) 1998-11-10 US disclosed