Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 4/20 | 0.90 |
| ▸ | CA12 | O43570 | 4/20 | 0.90 |
| ▸ | CA1 | P00915 | 4/20 | 0.90 |
| ▸ | CA2 | P00918 | 4/20 | 0.90 |
| ▸ | CA7 | P43166 | 4/20 | 0.90 |
| ▸ | CA9 | Q16790 | 4/20 | 0.90 |
| ▸ | CA14 | Q9ULX7 | 4/20 | 0.90 |
| ▸ | MAPT | P10636 | 3/20 | 0.90 |
| ▸ | LMNA | P02545 | 3/20 | 0.90 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.90 |
| ▸ | CA4 | P22748 | 3/20 | 0.90 |
| ▸ | CA6 | P23280 | 3/20 | 0.90 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.90 |
| ▸ | FUT7 | Q11130 | 2/20 | 0.90 |
| ▸ | CA3 | P07451 | 2/20 | 0.90 |
| ▸ | CA5A | P35218 | 2/20 | 0.90 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.90 |
| ▸ | TP53 | P04637 | 1/20 | 0.90 |
| ▸ | SELL | P14151 | 1/20 | 0.90 |
| ▸ | HPGD | P15428 | 1/20 | 0.90 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Gallic Acid SCHEMBL4918056 | 0.95 | CA12 (1.00) | KDM4ECA12CA1CA2CA7 | |
| Gallic Acid SCHEMBL30375631 | 0.95 | CA12 (1.00) | KDM4ECA12CA1CA2CA7 | |
| Gallic Acid SCHEMBL1845406 | 0.95 | CA12 (1.00) | KDM4ECA12CA1CA2CA7 | |
| Gallic Acid SCHEMBL678990 | 0.95 | CA12 (1.00) | KDM4ECA12CA1CA2CA7 | |
| Gallic Acid SCHEMBL8088102 | 0.95 | CA12 (1.00) | KDM4ECA12CA1CA2CA7 | |
| Gallic Acid SCHEMBL29484566 | 0.95 | CA12 (1.00) | KDM4ECA12CA1CA2CA7 | |
| Gallic Acid SCHEMBL15012 | 0.95 | CA12 (1.00) | KDM4ECA12CA1CA2CA7 | |
| Gallic Acid SCHEMBL5874545 | 0.92 | KDM4E (0.85) | KDM4ECA12CA1CA2CA7 | |
| Gallic Acid SCHEMBL28665982 | 0.92 | KDM4E (0.85) | KDM4ECA12CA1CA2CA7 | |
| Gallic Acid SCHEMBL597299 | 0.92 | CA12 (0.94) | KDM4ECA12CA1CA2CA7 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8057696-B2 | Compositions and methods for rapidly removing overfilled substrates | DUPONT AIR PRODUCTS NANOMATERIALS LLC (US) | 2011-11-15 | — | — | US | disclosed |
| US-8003587-B2 | Semiconductor process residue removal composition and process | EKC TECHNOLOGY, INC. (US) | 2011-08-23 | — | — | US | disclosed |
| EP-2222421-A1 | PRINTER HEAD AND PRINTER DISK CLEANING COMPOSITIONS AND METHODS OF USE | EKC TECHNOLOGY, INC. (US) | 2010-09-01 | — | — | EP | disclosed |
| EP-2191041-A1 | COMPOSITIONS AND METHOD FOR TREATING A COPPER SURFACE | EKC Technology, INC. (US) | 2010-06-02 | — | — | EP | disclosed |
| US-20090203566-A1 | Semi Conductor Process Residue Removal Composition and Process | EKC TECHNOLOGY, INC. | 2009-08-13 | — | — | US | disclosed |
| WO-2009070190-A1 | PRINTER HEAD AND PRINTER DISK CLEANING COMPOSITIONS AND METHODS OF USE | EKC TECHNOLOGY, INC. (US) | 2009-06-04 | — | — | WO | disclosed |
| US-20090137439-A1 | Printer Head and Printer Disk Cleaning Compositions and Methods of Use | EKC TECHNOLOGY, INC. | 2009-05-28 | — | — | US | disclosed |
| US-7528098-B2 | Semiconductor process residue removal composition and process | EKC TECHNOLOGY, INC. (US) | 2009-05-05 | — | — | US | disclosed |
| WO-2009032322-A1 | COMPOSITIONS AND METHOD FOR TREATING A COPPER SURFACE | EKC TECHNOLOGY, INC. (US) | 2009-03-12 | — | — | WO | disclosed |
| US-20090068846-A1 | COMPOSITIONS AND METHOD FOR TREATING A COPPER SURFACE | EKC TECHNOLOGY, INC. | 2009-03-12 | — | — | US | disclosed |
| WO-2005042658-A1 | ABRASIVE-FREE CHE.MICAL MECHANICAL POLISHING COMPOSITION AND POLISHING PROCESS CONTAINING SAME | DUPONT AIR PRODUCTS NANOMATERIALS LLC (US) | 2005-05-12 | — | — | WO | disclosed |
| US-20050090416-A1 | Semiconductor process residue removal composition and process | EKC TECHNOLOGY, INC. | 2005-04-28 | — | — | US | disclosed |
| EP-1509490-A1 | SEMICONDUCTOR PROCESS RESIDUE REMOVAL COMPOSITION AND PROCESS | EKC TECHNOLOGY, INC. (US) | 2005-03-02 | — | — | EP | disclosed |
| US-6825156-B2 | USING AQUEOUS SOLUTION OF 2-ETHYLAMINOETHYL-2-ETHANOL | EKC TECHNOLOGY, INC. | 2004-11-30 | — | — | US | disclosed |
| US-20040147420-A1 | Cleaning compositions containing hydroxylamine derivatives and processes using same for residue removal | EKC TECHNOLOGY, INC. | 2004-07-29 | — | — | US | disclosed |
| US-20040134873-A1 | Abrasive-free chemical mechanical polishing composition and polishing process containing same | VERSUM MATERIALS US, LLC | 2004-07-15 | — | — | US | disclosed |
| WO-2003104185-A1 | SEMICONDUCTOR PROCESS RESIDUE REMOVAL COMPOSITION AND PROCESS | EKC TECHNOLOGY, INC. (US) | 2003-12-18 | — | — | WO | disclosed |
| US-20030228990-A1 | Semiconductor process residue removal composition and process | EKC TECHNOLOGY, INC. | 2003-12-11 | — | — | US | disclosed |
| US-6276372-B1 | REMOVING PHOTORESIST RESIDUE OR OTHER POLYMERIC MATERIAL FROM A SUBSTRATE SUCH AS AN INTEGRATED CIRCUIT SEMICONDUCTOR WAFER; USING HYDROXYLAMINE, AT LEAST ONE MISCIBLE ALCOHOL AMINE, GALLIC ACID AND WATER; CORROSION RESISTANCE | EKC TECHNOLOGY | 2001-08-21 | — | — | US | disclosed |
| US-6276372-B1 | REMOVING PHOTORESIST RESIDUE OR OTHER POLYMERIC MATERIAL FROM A SUBSTRATE SUCH AS AN INTEGRATED CIRCUIT SEMICONDUCTOR WAFER; USING HYDROXYLAMINE, AT LEAST ONE MISCIBLE ALCOHOL AMINE, GALLIC ACID AND WATER; CORROSION RESISTANCE | EKC TECHNOLOGY | 2001-08-21 | — | — | US | disclosed |