SCHEMBL13259671

SCHEMBL13259671

CC(CC(C)(C)O[Si](C)(C)C)C[Si](C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13259669 0.74
SCHEMBL14488509 0.66
SCHEMBL13039737 0.66
SCHEMBL7928079 0.63 TSHR (0.45)
SCHEMBL6251160 0.63 CYP2D6 (0.37)
SCHEMBL14298961 0.62
SCHEMBL107707 0.59
SCHEMBL14389684 0.59
SCHEMBL10036199 0.59
SCHEMBL12261306 0.59

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7763358-B2 Silicone emulsion composition and wood treatment SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-07-27 US disclosed
US-7488539-B2 significantly improved in minimum melt viscosity and gives a cured product flexible enough to show no cracking or exfoliation SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-02-10 US disclosed
US-20070134423-A1 Silicone emulsion composition and wood treatment SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-06-14 US disclosed
US-20070120271-A1 Dicing and die bonding adhesive tape SHIN-ETSU CHEMICAL CO., LTD. 2007-05-31 US disclosed
US-20070090299-A1 Adhesive composition and sheet having an adhesive layer of the composition SHIN-ETSU CHEMICAL CO., LTD. 2007-04-26 US disclosed