SCHEMBL132626

SCHEMBL132626

CCCCCCCCCCCCc1ccccc1[I+]c1ccccc1CCCCCCCCCCCC.F[B-](F)(F)F

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LIPG Q9Y5X9 1/20 0.50
NR1H2 P55055 1/20 0.42
NR1H3 Q13133 1/20 0.42
CYSLTR2 Q9NS75 4/20 0.41
CYSLTR1 Q9Y271 4/20 0.41
BID P55957 3/20 0.40
MCL1 Q07820 3/20 0.40
BCL2L1 Q07817 2/20 0.40
BAK1 Q16611 2/20 0.40
KAT8 Q9H7Z6 2/20 0.40
PPARA Q07869 2/20 0.40
PPARG P37231 1/20 0.40
EP300 Q09472 1/20 0.40
KAT2A Q92830 1/20 0.40
KAT2B Q92831 1/20 0.40
KAT5 Q92993 1/20 0.40
SAE1 Q9UBE0 1/20 0.40
THRA P10827 1/20 0.39
THRB P10828 1/20 0.39
ALOX5 P09917 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29584401 1.00 LIPG (0.50) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL5413206 1.00 LIPG (0.50) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL29470133 0.93 LIPG (0.56) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL11149596 0.93 LIPG (0.56) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL123866 0.93 LIPG (0.56) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL5027433 0.93 LIPG (0.56) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
Hydrochloric Acid SCHEMBL8180220 0.91 LIPG (0.55) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL29583738 0.90 LIPG (0.50) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL31477908 0.90 LIPG (0.50) LIPGNR1H2NR1H3CYSLTR2CYSLTR1
SCHEMBL29470149 0.90 LIPG (0.50) LIPGNR1H2NR1H3CYSLTR2CYSLTR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 416 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106125509-B LED-curable liquid resin composition for additive fabrication 帝斯曼知识产权资产管理有限公司 2019-12-17 CN claimed
EP-2513722-B1 LED CURABLE LIQUID RESIN COMPOSITIONS FOR ADDITIVE FABRICATION, PROCESS FOR MAKING A THREE-DIMENSIONAL OBJECT USING THE SAME DSM IP ASSETS BV (NL) 2017-01-25 EP claimed
US-8415081-B2 Photosensitive resin composition having a high refractive index CORNELL RESEARCH FOUNDATION, INC. (US) 2013-04-09 US claimed
EP-2513722-A1 LED CURABLE LIQUID RESIN COMPOSITIONS FOR ADDITIVE FABRICATION DSM IP Assets B.V. (NL) 2012-10-24 EP claimed
US-20120259031-A1 LED CURABLE LIQUID RESIN COMPOSITIONS FOR ADDITIVE FABRICATION DSM IP ASSETS, B.V. (NL) 2012-10-11 US claimed
WO-2011075555-A1 LED CURABLE LIQUID RESIN COMPOSITIONS FOR ADDITIVE FABRICATION DSM IP ASSETS, B.V. (NL) 2011-06-23 WO claimed
US-20080038665-A1 Photosensitive Resin Composition Having a High Refractive Index HITACHI CHEMICAL CO., LTD. (JP) 2008-02-14 US claimed
US-12516211-B2 Ink composition and electronic device including film formed using the ink composition SAMSUNG DISPLAY CO., LTD. (KR) 2026-01-06 US disclosed
EP-4634262-A1 ONE-COMPONENT CATIONIC POLYMERIZABLE COMPOSITION Huntsman Advanced Materials (Switzerland) GmbH (CH) 2025-10-22 EP disclosed
US-12410345-B2 Polyvinyl aromate-polydiene-block copolymer-based adhesive compounds having improved thermal shear strength TESA SE (DE) 2025-09-09 US disclosed
EP-4155361-B1 ADHESIVE COMPOSITION NIPPON SODA CO (JP) 2025-09-03 EP disclosed
WO-2025121201-A1 METHOD FOR MANUFACTURING WIRING BOARD WITH PROTECTIVE MATERIAL, CURABLE COMPOSITION, AND WIRING BOARD WITH PROTECTIVE MATERIAL コニカミノルタ株式会社 2025-06-12 WO disclosed
CN-222886721-U Reactive adhesive tape 德莎欧洲股份公司 2025-05-20 CN disclosed
US-6406770-B1 MULTILAYER; CONTAINING CATIONIC POLYMER DAINIPPON INK AND CHEMICALS, INC. (JP) 2002-06-18 US disclosed
WO-2002008347-A2 RESIST INK COMPOSITION SHOWA DENKO K. K. (JP) 2002-01-31 WO disclosed
WO-2001088053-A1 RIGID SUBSTRATE LAMINATION ADHESIVE 3M INNOVATIVE PROPERTIES COMPANY (US) 2001-11-22 WO disclosed
WO-2001087595-A1 RIGID SUBSTRATE LAMINATION PROCESS, SYSTEM, AND PRODUCT 3M INNOVATIVE PROPERTIES COMPANY (US) 2001-11-22 WO disclosed
WO-2001083580-A2 POLYMERIZABLE COMPOSITION, CURED MATERIAL THEREOF AND METHOD FOR MANUFACTURING THE SAME SHOWA DENKO K. K. (JP) 2001-11-08 WO disclosed
EP-1083557-A1 OPTICAL DISK PRODUCTION DEVICE DAINIPPON INK AND CHEMICALS, INC. (JP) 2001-03-14 EP disclosed
EP-1005037-A1 OPTICAL DISK AND METHOD OF MANUFACTURING OPTICAL DISK DAINIPPON INK AND CHEMICALS, INC. (JP) 2000-05-31 EP disclosed