SCHEMBL1326440

SCHEMBL1326440

CC(C)(C)OOC(=O)CCCCC(=O)OOC(C)(C)C

nearest known ligand 0.40

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.40
ALDH1A1 P00352 2/20 0.38
TDP1 Q9NUW8 2/20 0.38
HSD17B10 Q99714 1/20 0.38
DGKA P23743 1/20 0.37
RECQL P46063 1/20 0.37
LMNA P02545 3/20 0.34
EPHX2 P34913 1/20 0.34
PAM P19021 2/20 0.33
HDAC1 Q13547 1/20 0.32
HDAC2 Q92769 1/20 0.32
HDAC6 Q9UBN7 1/20 0.32
GAA P10253 1/20 0.32
MAPT P10636 1/20 0.32
MAPK1 P28482 1/20 0.32
CYP1A2 P05177 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11420930 0.98 DGKA (0.40) TSHRALDH1A1TDP1HSD17B10DGKA
SCHEMBL28325994 0.98 DGKA (0.40) TSHRALDH1A1TDP1HSD17B10DGKA
SCHEMBL2399659 0.98 DGKA (0.40) TSHRALDH1A1TDP1HSD17B10DGKA
SCHEMBL11413523 0.95 TSHR (0.46) TSHRALDH1A1TDP1HSD17B10DGKA
SCHEMBL30023130 0.91 EPHX2 (0.43) TSHRALDH1A1TDP1HSD17B10DGKA
SCHEMBL28009532 0.91 TSHR (0.48) TSHRALDH1A1TDP1HSD17B10LMNA
SCHEMBL7646063 0.91 TSHR (0.34) TSHRALDH1A1TDP1HSD17B10DGKA
SCHEMBL1310972 0.91 DGKA (0.50) TSHRALDH1A1DGKALMNAPAM
SCHEMBL11126370 0.90 TSHR (0.41) TSHRALDH1A1TDP1HSD17B10RECQL
SCHEMBL9142434 0.89 DGKA (0.53) TSHRALDH1A1TDP1HSD17B10DGKA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4565561-A1 METHOD FOR PREPARING A COMPOSITION IN POWDER FORM COMPRISING AT LEAST ONE SOLID ORGANIC PEROXIDE ARKEMA FRANCE (FR) 2025-06-11 EP disclosed
WO-2024048055-A1 RESIN COMPOSITION, ADHESIVE FILM, BONDING SHEET FOR INTERLAYER ADHESION, AND RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE WITH ANTENNA ナミックス株式会社 2024-03-07 WO disclosed
WO-2024028229-A1 METHOD FOR PREPARING A COMPOSITION IN POWDER FORM COMPRISING AT LEAST ONE SOLID ORGANIC PEROXIDE ARKEMA FRANCE (FR) 2024-02-08 WO disclosed
EP-4317222-A1 (METH)ACRYLIC ACID ESTER-BASED COPOLYMER AND CURABLE COMPOSITION Kaneka Corporation (JP) 2024-02-07 EP disclosed
EP-4317207-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF Kaneka Corporation (JP) 2024-02-07 EP disclosed
WO-2024023460-A1 COMPOSITION COMPRISING AT LEAST ONE SOLID ORGANIC PEROXIDE ARKEMA FRANCE (FR) 2024-02-01 WO disclosed
US-20240018287-A1 (METH)ACRYLIC ESTER COPOLYMER AND CURABLE COMPOSITION KANEKA CORPORATION (JP) 2024-01-18 US disclosed
CN-117015561-A (meth) acrylate copolymer and curable composition 株式会社钟化 2023-11-07 CN disclosed
CN-116997610-A Curable composition and cured product thereof 株式会社钟化 2023-11-03 CN disclosed
US-20230299461-A1 ANTENNA-EQUIPPED SEMICONDUCTOR PACKAGE AND RESIN COMPOSITION FOR ANTENNA-EQUIPPED SEMICONDUCTOR PACKAGE NAMICS CORPORATION (JP) 2023-09-21 US disclosed
WO-2001025358-A1 POWDER COATING COMPOSITIONS GENERAL ELECTRIC COMPANY (US) 2001-04-12 WO disclosed
US-6194495-B1 CURBLE COMPOSITION WITH ARYLOXYTRIAZINE GENERAL ELECTRIC COMPANY 2001-02-27 US disclosed
US-6162876-A Cyanate ester based thermoset compositions GENERAL ELECTRIC COMPANY (US) 2000-12-19 US disclosed
US-6051662-A POLYPHENYLENE ETHER RESIN COMPONENT HAS A MOLECULAR WEIGHT OF LESS THAN ABOUT 3000 NUMBER AVERAGE IN CONTRAST TO HIGHER POLYPHENYLENE ETHERS EMPLOYED IN OTHER POLYPHENYLENE ETHER-THERMOSETTING RESIN FOR USE IN PRINTED CIRCUIT BOARD GENERAL ELECTRIC CO. (US) 2000-04-18 US disclosed
EP-0962495-A1 A curable polyphenylene ether-thermosetting resin composition GENERAL ELECTRIC COMPANY (US) 1999-12-08 EP disclosed
EP-0945477-A1 Cyanate ester based thermoset compositions GENERAL ELECTRIC COMPANY (US) 1999-09-29 EP disclosed
EP-0921158-A2 Poly(phenylene ether) thermoset compositions GENERAL ELECTRIC COMPANY (US) 1999-06-09 EP disclosed
US-5834565-A FOR PRINTED CIRCUIT BOARDS GENERAL ELECTRIC COMPANY (US) 1998-11-10 US disclosed
US-4219675-A Batch process for manufacturing and purifying liquid organic peroxide by distillation PENNWALT CORPORATION (US) 1980-08-26 US disclosed
US-4075236-A FROM ACID CHLORIDE, A HYDROPEROXIDE AND AN ALKALI METAL HYDROXIDE PENNWALT CORPORATION (US) 1978-02-21 US disclosed