Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 6/20 | 0.62 |
| ▸ | CA2 | P00918 | 6/20 | 0.62 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.54 |
| ▸ | GAA | P10253 | 2/20 | 0.53 |
| ▸ | MEN1 | O00255 | 1/20 | 0.52 |
| ▸ | NPC1 | O15118 | 1/20 | 0.48 |
| ▸ | RAB9A | P51151 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12268555 | 0.98 | CA1 (0.66) | CA1CA2KMT2AALDH1A1GAA | |
| SCHEMBL12282274 | 0.90 | CA1 (0.56) | CA1CA2KMT2AALDH1A1 | |
| SCHEMBL13477975 | 0.87 | KMT2A (0.67) | CA1CA2KMT2AALDH1A1 | |
| SCHEMBL12268791 | 0.85 | KMT2A (0.57) | CA1CA2KMT2AMEN1NPC1 | |
| SCHEMBL13477974 | 0.83 | KMT2A (0.62) | CA1CA2KMT2AALDH1A1 | |
| SCHEMBL13318228 | 0.83 | CA1 (0.47) | CA1CA2KMT2AALDH1A1GAA | |
| SCHEMBL12268854 | 0.82 | ALDH1A1 (0.58) | CA1CA2KMT2AALDH1A1GAA | |
| SCHEMBL3192700 | 0.81 | KMT2A (0.62) | CA1CA2KMT2AALDH1A1MEN1 | |
| SCHEMBL10013565 | 0.81 | KMT2A (0.54) | CA1CA2KMT2AALDH1A1GAA | |
| SCHEMBL13318217 | 0.81 | ALDH1A1 (0.66) | CA1CA2KMT2AALDH1A1GAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8765012-B2 | Thermosetting composition and printed circuit board using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2014-07-01 | — | — | US | disclosed |
| US-20100124037-A1 | THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-05-20 | — | — | US | disclosed |