Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FDPS | P14324 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1874819 | 0.97 | FDPS (0.32) | FDPSTSHRLMNA | |
| SCHEMBL3170392 | 0.81 | — | — | |
| SCHEMBL3161767 | 0.78 | — | — | |
| SCHEMBL17184251 | 0.77 | FDPS (0.32) | FDPSTSHRLMNA | |
| Ammonia Solution, Strong SCHEMBL27888330 | 0.77 | FDPS (0.32) | FDPSTSHR | |
| SCHEMBL17468043 | 0.77 | TSHR (0.36) | TSHRLMNA | |
| SCHEMBL15532289 | 0.77 | FDPS (0.32) | FDPSTSHRLMNA | |
| Ammonia Solution, Strong SCHEMBL1335118 | 0.76 | FDPS (0.34) | FDPS | |
| SCHEMBL29002257 | 0.76 | TSHR (0.35) | FDPSTSHRLMNA | |
| SCHEMBL3167553 | 0.75 | FDPS (0.31) | FDPSTSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 95 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8859437-B2 | Solution for etching a thin film transistor and method of manufacturing the same | THE PENN STATE RESEARCH FOUNDATION (US) | 2014-10-14 | — | — | US | claimed |
| US-20140193945-A1 | SOLUTION FOR ETCHING A THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME | THE PENN STATE RESEARCH FOUNDATION | 2014-07-10 | — | — | US | claimed |
| EP-2122418-B1 | STRIPPER FOR COATING LAYER | AZ ELECTRONIC MATERIALS USA (US) | 2012-08-08 | — | — | EP | claimed |
| US-20120187336-A1 | CONDITIONING COMPOSITIONS FOR SOLAR CELLS | SURFACE CHEMISTRY DISCOVERIES, INC. (US) | 2012-07-26 | — | — | US | claimed |
| US-8026201-B2 | Comprising: a fluoride source, an organic quaternary ammonium base, and a solvent selected from an organic solvent, water, and mixtures thereof; for removing silicon-based anti-reflective coatings/hardmask layers from microelectronics; etch selectivity | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2011-09-27 | — | — | US | claimed |
| EP-2122418-A2 | STRIPPER FOR COATING LAYER | AZ Electronic Materials USA Corp. (US) | 2009-11-25 | — | — | EP | claimed |
| US-20090120457-A1 | COMPOSITIONS AND METHOD FOR REMOVING COATINGS AND PREPARATION OF SURFACES FOR USE IN METAL FINISHING, AND MANUFACTURING OF ELECTRONIC AND MICROELECTRONIC DEVICES | SURFACE CHEMISTRY DISCOVERIES, INC. (US) | 2009-05-14 | — | — | US | claimed |
| WO-2008081416-A2 | STRIPPER FOR COATING LAYER | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2008-07-10 | — | — | WO | claimed |
| US-20080161217-A1 | Stripper for Coating Layer | MERCK PATENT GMBH (DE) | 2008-07-03 | — | — | US | claimed |
| EP-1027415-A1 | CLEANING COMPOSITIONS AND METHODS FOR CLEANING RESIN AND POLYMERIC MATERIALS USED IN MANUFACTURE | Kyzen Corporation (US) | 2000-08-16 | — | — | EP | claimed |
| WO-1999016855-A1 | CLEANING COMPOSITIONS AND METHODS FOR CLEANING RESIN AND POLYMERIC MATERIALS USED IN MANUFACTURE | KYZEN CORPORATION (US) | 1999-04-08 | — | — | WO | claimed |
| CN-113430069-B | Low-hydroxylamine water-based cleaning solution, and preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2024-08-23 | — | — | CN | disclosed |
| CN-113430070-B | CoWP compatible semi-water-based cleaning solution, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2024-08-23 | — | — | CN | disclosed |
| CN-113430064-B | Hydroxylamine-free water-based cleaning solution, and preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2024-04-26 | — | — | CN | disclosed |
| US-10908505-B2 | Photoresist developer composition and manufacturing method of semiconductor package using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2021-02-02 | — | — | US | disclosed |
| US-5962383-A | USING MIXTURE CONTAINING TETRAHYDROFURFURYL ALCOHOL AND TETRAMETHYLAMMONIUM HYDROXIDE AND WATER | KYZEN CORPORATION (US) | 1999-10-05 | — | — | US | disclosed |
| US-5498293-A | TREATMENT WITH ALKALINE SOLUTION AND AMPHOTERIC SURFACTANT | MALLINCKRODT BAKER, INC. (US) | 1996-03-12 | — | — | US | disclosed |
| EP-0690483-A2 | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness | MALLINCKRODT BAKER, Inc. (US) | 1996-01-03 | — | — | EP | disclosed |
| US-5466389-A | Cleaning compounds with metal free base and surfactant | J. T. BAKER INC. (US) | 1995-11-14 | — | — | US | disclosed |
| EP-0678571-A2 | pH Adjusted nonionic surfactant containing alkaline cleaner composition for cleaning microelectronics substrates | MALLINCKRODT BAKER, Inc. (US) | 1995-10-25 | — | — | EP | disclosed |