Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AGXT | P21549 | 4/20 | 0.43 |
| ▸ | IDO1 | P14902 | 2/20 | 0.43 |
| ▸ | TSHR | P16473 | 1/20 | 0.42 |
| ▸ | HRH3 | Q9Y5N1 | 6/20 | 0.41 |
| ▸ | NAAA | Q02083 | 2/20 | 0.37 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.35 |
| ▸ | PPARG | P37231 | 2/20 | 0.35 |
| ▸ | PPARA | Q07869 | 2/20 | 0.35 |
| ▸ | BDKRB2 | P30411 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12807986 | 0.93 | EGFR (0.39) | AGXTIDO1TSHRHRH3KCNH2 | |
| SCHEMBL133476 | 0.92 | TSHR (0.48) | AGXTIDO1TSHRKCNH2 | |
| SCHEMBL2614813 | 0.91 | IDO1 (0.57) | AGXTIDO1TSHRNAAA | |
| SCHEMBL27980931 | 0.91 | ESR1 (0.48) | IDO1 | |
| SCHEMBL27430936 | 0.89 | MCL1 (0.41) | TSHRHRH3 | |
| SCHEMBL8750395 | 0.84 | TP53 (0.43) | TSHRKCNH2 | |
| SCHEMBL8731487 | 0.84 | ALDH1A1 (0.48) | TSHRPPARGPPARA | |
| SCHEMBL8726810 | 0.84 | ALDH1A1 (0.41) | AGXTIDO1TSHRHRH3 | |
| SCHEMBL11213843 | 0.84 | CYP2A6 (0.53) | TSHRHRH3NAAA | |
| SCHEMBL8725419 | 0.84 | ALDH1A1 (0.48) | TSHRPPARGPPARA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118955830-B | Phenolic resin, epoxy resin and cured product thereof | 上海衡封新材料科技有限公司 | 2025-05-30 | — | — | CN | disclosed |
| CN-119948079-A | Multifunctional vinyl resin, method for producing the same, composition and cured product | 日铁化学材料株式会社 | 2025-05-06 | — | — | CN | disclosed |
| CN-119604586-A | Resin composition and cured product | 日铁化学材料株式会社 | 2025-03-11 | — | — | CN | disclosed |
| CN-118955830-A | Phenolic resin, epoxy resin and cured product thereof | 上海衡封新材料科技有限公司 | 2024-11-15 | — | — | CN | disclosed |
| CN-111378093-B | Epoxy resin, method for producing same, epoxy resin composition, and epoxy resin cured product | 日铁化学材料株式会社 | 2024-09-03 | — | — | CN | disclosed |
| CN-114989376-B | Phenolic resin, epoxy resin and cured product thereof | 上海衡封新材料科技有限公司 | 2024-08-23 | — | — | CN | disclosed |
| CN-117460756-A | Epoxy resin, epoxy resin composition and cured product thereof | 日铁化学材料株式会社 | 2024-01-26 | — | — | CN | disclosed |
| US-20230272156-A1 | CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT | DIC CORPORATION (JP) | 2023-08-31 | — | — | US | disclosed |
| WO-2023063122-A1 | CURABLE RESIN COMPOSITION, PREPREG, AND CURED PRODUCT OF SAME | 日本化薬株式会社 | 2023-04-20 | — | — | WO | disclosed |
| CN-108884302-B | Thermosetting resin composition, prepreg, and cured product thereof | 日本化药株式会社 | 2023-03-28 | — | — | CN | disclosed |
| US-20080255315-A1 | Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2008-10-16 | — | — | US | disclosed |
| EP-1785441-A1 | EPOXY RESIN COMPOSITION, PRODUCTS OF CURING THEREOF, MATERIAL FOR THE ENCAPSULATION OF SEMICONDUCTORS, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, PROCESS FOR PRODUCTION OF NOVEL PHENOL RESIN AND PROCESS FOR PRODUCTION OF NOVEL EPOXY RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2007-05-16 | — | — | EP | disclosed |
| EP-1323761-B1 | POLYPHENOL RESIN, PROCESS FOR ITS PRODUCTION, EPOXY RESIN COMPOSITION AND ITS USE | NIPPON KAYAKU KK (JP) | 2007-04-25 | — | — | EP | disclosed |
| US-20040166326-A1 | Polyphenol resin, method for producing the same, epoxy resin composition and use thereof | AKATSUKA YASUMASA (JP) | 2004-08-26 | — | — | US | disclosed |
| US-6723801-B2 | AS CURING AGENT FOR EPOXY RESINS | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2004-04-20 | — | — | US | disclosed |
| EP-1323761-A1 | POLYPHENOL RESIN, PROCESS FOR ITS PRODUCTION, EPOXY RESIN COMPOSITION AND ITS USE | Nippon Kayaku Kabushiki Kaisha (JP) | 2003-07-02 | — | — | EP | disclosed |
| US-20030009001-A1 | Polyphenol resin, process for its production, epoxy resin composition and its use | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2003-01-09 | — | — | US | disclosed |
| EP-0644216-B1 | NAPHTHALENE-RING RESIN, RESIN COMPOSITION, AND CURED PRODUCT THEREOF | NIPPON KAYAKU KK (JP) | 1996-07-17 | — | — | EP | disclosed |
| EP-0644216-A1 | NAPHTHALENE-RING RESIN, RESIN COMPOSITION, AND CURED PRODUCT THEREOF | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 1995-03-22 | — | — | EP | disclosed |
| US-4163731-A | HYDRAULIC FLUIDS | CIBA-GEIGY AG (CH) | 1979-08-07 | — | — | US | disclosed |