SCHEMBL13380461

SCHEMBL13380461

COCOC(=O)c1ccc(OCOc2ccc(C(C)=O)cc2C)c(C)c1

nearest known ligand 0.44

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.44
MEN1 O00255 3/20 0.44
SMN1; SMN2 Q16637 2/20 0.44
ALDH1A1 P00352 7/20 0.42
MAPT P10636 4/20 0.42
TSHR P16473 4/20 0.42
POLB P06746 1/20 0.41
CREBBP Q92793 2/20 0.41
RXFP1 Q9HBX9 1/20 0.41
KDM4E B2RXH2 1/20 0.41
HPGD P15428 1/20 0.41
HSD17B10 Q99714 1/20 0.41
MAPK1 P28482 2/20 0.40
HSD17B2 P37059 1/20 0.40
GAA P10253 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.40
MAPK10 P53779 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2463760 0.88 CREBBP (0.47) KMT2AMEN1ALDH1A1MAPTPOLB
SCHEMBL334307 0.84 HSD17B2 (0.54) KMT2AMEN1SMN1; SMN2MAPTTSHR
SCHEMBL12146850 0.79 CYP2A6 (0.46) KMT2AMEN1SMN1; SMN2ALDH1A1MAPT
SCHEMBL12146848 0.78 CYP2A6 (0.53) KMT2AMEN1SMN1; SMN2ALDH1A1MAPT
SCHEMBL12146851 0.77 MAPT (0.47) KMT2AMEN1SMN1; SMN2ALDH1A1MAPT
SCHEMBL6155851 0.76 KMT2A (0.46) KMT2AMEN1SMN1; SMN2ALDH1A1MAPT
SCHEMBL1642727 0.76 CREBBP (0.68) KMT2AMEN1SMN1; SMN2ALDH1A1MAPT
SCHEMBL16382251 0.75 ESR1 (0.43) MAPTTSHRPOLBKDM4EHSD17B2
SCHEMBL12441833 0.75 HPGD (0.45) KMT2AMEN1SMN1; SMN2ALDH1A1MAPT
SCHEMBL12493300 0.74 TAS1R3 (0.60) SMN1; SMN2ALDH1A1TSHRCREBBPHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20100078330-A1 APPARATUS AND METHOD FOR MANUFACTURING PLATED FILM FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-7618526-B2 Bringing a resin film having a conductive surface into electrical contact with a cathode rollwith a liquid film interposed between the film and the cathode and forming a metal plating on the conductive surface of the film; equation of relationship of electrical properties;continuous processing TORAY INDUSTRIES, INC. (JP) 2009-11-17 US disclosed