Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 3/20 | 0.39 |
| ▸ | CA12 | O43570 | 2/20 | 0.39 |
| ▸ | GMNN | O75496 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.39 |
| ▸ | CA1 | P00915 | 2/20 | 0.39 |
| ▸ | CA2 | P00918 | 2/20 | 0.39 |
| ▸ | LMNA | P02545 | 2/20 | 0.39 |
| ▸ | BLM | P54132 | 2/20 | 0.39 |
| ▸ | CA9 | Q16790 | 2/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.39 |
| ▸ | SGMS1 | Q86VZ5 | 1/20 | 0.39 |
| ▸ | SGMS2 | Q8NHU3 | 1/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | TP53 | P04637 | 1/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.38 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.38 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.38 |
| ▸ | TSHR | P16473 | 1/20 | 0.38 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22200955 | 0.87 | MAPT (0.38) | MAPTCA12GMNNALDH1A1CA1 | |
| SCHEMBL11965879 | 0.86 | MAPT (0.43) | MAPTCA12GMNNALDH1A1CA1 | |
| SCHEMBL13388372 | 0.81 | MAPT (0.39) | MAPTCA12GMNNALDH1A1CA1 | |
| SCHEMBL11965930 | 0.81 | MAPT (0.41) | MAPTCA12GMNNALDH1A1CA1 | |
| SCHEMBL2740750 | 0.80 | — | — | |
| SCHEMBL18698640 | 0.80 | — | — | |
| SCHEMBL24084357 | 0.80 | ALDH1A1 (0.53) | MAPTCA12GMNNALDH1A1CA1 | |
| SCHEMBL21653902 | 0.80 | ALDH1A1 (0.53) | MAPTCA12GMNNALDH1A1CA1 | |
| SCHEMBL22841009 | 0.80 | ALDH1A1 (0.53) | MAPTCA12GMNNALDH1A1CA1 | |
| SCHEMBL14413809 | 0.80 | ALDH1A1 (0.53) | MAPTCA12GMNNALDH1A1CA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023228926-A1 | POLYMER AND RESIN COMPOSITION FOR RESISTS | 丸善石油化学株式会社 | 2023-11-30 | — | — | WO | disclosed |
| WO-2023204281-A1 | RESIN COMPOSITION FOR THERMOSETTING PHOTO-ALIGNMENT FILMS | 日産化学株式会社 | 2023-10-26 | — | — | WO | disclosed |
| WO-2023157934-A1 | RESIN COMPOSITION FOR THERMOSETTING PHOTO-ALIGNMENT FILMS | 日産化学株式会社 | 2023-08-24 | — | — | WO | disclosed |
| US-10392699-B2 | Method for manufacturing structure having recessed pattern, resin composition, method for forming electroconductive film, electronic circuit, and electronic device | JSR CORPORATION (JP) | 2019-08-27 | — | — | US | disclosed |
| US-20170306481-A1 | METHOD FOR MANUFACTURING STRUCTURE HAVING RECESSED PATTERN, RESIN COMPOSITION, METHOD FOR FORMING ELECTROCONDUCTIVE FILM, ELECTRONIC CIRCUIT, AND ELECTRONIC DEVICE | JSR CORPORATION (JP) | 2017-10-26 | — | — | US | disclosed |
| US-9746775-B2 | Method for manufacturing substrate having concave pattern, composition, method for forming conductive film, electronic circuit and electronic device | JSR CORPORATION (JP) | 2017-08-29 | — | — | US | disclosed |
| EP-2993519-A1 | METHOD FOR MANUFACTURING BASE MATERIAL HAVING RECESSED PATTERN, COMPOSITION, METHOD FOR FORMING ELECTRICALLY CONDUCTIVE FILM, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE | JSR Corporation (JP) | 2016-03-09 | — | — | EP | disclosed |
| US-20160062242-A1 | METHOD FOR MANUFACTURING SUBSTRATE HAVING CONCAVE PATTERN, COMPOSITION, METHOD FOR FORMING CONDUCTIVE FILM, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE | JSR CORPORATION (JP) | 2016-03-03 | — | — | US | disclosed |
| US-20160054616-A1 | ARRAY SUBSTRATE, LIQUID CRYSTAL DISPLAY ELEMENT, AND RADIATION-SENSITIVE RESIN COMPOSITION | JSR CORPORATION (JP) | 2016-02-25 | — | — | US | disclosed |
| US-20140014928-A1 | ORGANIC EL ELEMENT, RADIATION-SENSITIVE RESIN COMPOSITION, AND CURED FILM | JSR CORPORATION (JP) | 2014-01-16 | — | — | US | disclosed |
| US-8563214-B2 | Radiation sensitive resin composition and method of forming an interlayer insulating film | SHARP CORPORATION (JP) | 2013-10-22 | — | — | US | disclosed |
| US-20120270151-A1 | RADIATION SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING AN INTERLAYER INSULATING FILM | JSR CORPORATION (JP) | 2012-10-25 | — | — | US | disclosed |