SCHEMBL13399535

SCHEMBL13399535

O=C1N[C@H](Cc2ccc(Cl)cc2)C(=O)N[C@@H]1Cc1ccc(Cl)cc1

nearest known ligand 0.47

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
MDM2 Q00987 2/20 0.47
PPARG P37231 1/20 0.45
DAO P14920 4/20 0.42
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
IDO1 P14902 1/20 0.39
HRH3 Q9Y5N1 1/20 0.39
KDM4E B2RXH2 1/20 0.39
MMP2 P08253 1/20 0.39
MAOB P27338 2/20 0.38
CACNA1G O43497 1/20 0.38
ALDH1A1 P00352 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13399578 1.00 MDM2 (0.47) MDM2PPARGDAOMEN1KMT2A
SCHEMBL13399537 1.00 MDM2 (0.47) MDM2PPARGDAOMEN1KMT2A
SCHEMBL13428077 0.91 MEN1 (0.49) MDM2PPARGMEN1KMT2AALDH1A1
SCHEMBL21715206 0.91 GSK3B (0.46) MDM2PPARGDAOMEN1KMT2A
SCHEMBL6704329 0.88 PPARG (0.44) MDM2PPARGDAOKDM4E
SCHEMBL25368532 0.84 KDM4E (0.60) MDM2PPARGDAOMEN1KMT2A
SCHEMBL21715207 0.83 GHSR (0.40) MDM2PPARGKMT2A
SCHEMBL20747214 0.81 HDAC8 (0.39) MDM2PPARG
SCHEMBL18577063 0.81 HDAC8 (0.39) MDM2PPARG
SCHEMBL20628974 0.81 HDAC8 (0.39) MDM2PPARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524830-B2 Resin composition and resin molded product SONY CORPORATION (JP) 2013-09-03 US disclosed
US-8524830-B2 Resin composition and resin molded product SONY CORPORATION (JP) 2013-09-03 US disclosed
US-20100081766-A1 RESIN COMPOSITION AND RESIN MOLDED PRODUCT SONY CORPORATION (JP) 2010-04-01 US disclosed
US-20100081766-A1 RESIN COMPOSITION AND RESIN MOLDED PRODUCT SONY CORPORATION (JP) 2010-04-01 US disclosed