SCHEMBL13399673

SCHEMBL13399673

O=C1N[C@H](Cc2c[nH]c3ccccc23)C(=O)N[C@H]1Cc1c[nH]c2ccccc12

nearest known ligand 0.80

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 2/20 0.76
GSK3B P49841 2/20 0.64
KMT2A Q03164 4/20 0.62
MAPT P10636 3/20 0.62
MEN1 O00255 2/20 0.62
TP53 P04637 1/20 0.62
GLA P06280 1/20 0.62
CYP3A4 P08684 1/20 0.62
THRB P10828 1/20 0.62
RIPK1 Q13546 1/20 0.62
SMN1; SMN2 Q16637 1/20 0.62
HSD17B10 Q99714 1/20 0.62
L3MBTL1 Q9Y468 1/20 0.62
TACR2 P21452 9/20 0.62
KDM4E B2RXH2 1/20 0.60
ALDH1A1 P00352 1/20 0.60
POLB P06746 1/20 0.60
HPGD P15428 1/20 0.60
TNF P01375 1/20 0.56

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12809540 1.00 IDO1 (0.76) IDO1GSK3BKMT2AMAPTMEN1
SCHEMBL14595068 1.00 IDO1 (0.76) IDO1GSK3BKMT2AMAPTMEN1
SCHEMBL17867048 1.00 IDO1 (0.76) IDO1GSK3BKMT2AMAPTMEN1
SCHEMBL2042419 1.00 IDO1 (0.76) IDO1GSK3BKMT2AMAPTMEN1
SCHEMBL4404006 0.94 IDO1 (0.68) IDO1GSK3BKMT2AMAPTMEN1
SCHEMBL31485774 0.92 IDO1 (0.67) IDO1GSK3BKMT2AMAPTMEN1
SCHEMBL29701948 0.92 TACR2 (0.72) IDO1KMT2AMEN1TACR2
SCHEMBL13784333 0.92 IDO1 (0.67) IDO1GSK3BKMT2AMAPTMEN1
SCHEMBL17867293 0.92 TACR2 (0.72) IDO1KMT2AMEN1TACR2
SCHEMBL29701947 0.92 TACR2 (0.72) IDO1KMT2AMEN1TACR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524830-B2 Resin composition and resin molded product SONY CORPORATION (JP) 2013-09-03 US disclosed
US-8524830-B2 Resin composition and resin molded product SONY CORPORATION (JP) 2013-09-03 US disclosed
US-20100081766-A1 RESIN COMPOSITION AND RESIN MOLDED PRODUCT SONY CORPORATION (JP) 2010-04-01 US disclosed
US-20100081766-A1 RESIN COMPOSITION AND RESIN MOLDED PRODUCT SONY CORPORATION (JP) 2010-04-01 US disclosed