⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7518750 | 0.81 | — | — | |
| SCHEMBL7514639 | 0.81 | — | — | |
| SCHEMBL7524037 | 0.81 | — | — | |
| SCHEMBL7512780 | 0.81 | — | — | |
| SCHEMBL7515259 | 0.81 | — | — | |
| SCHEMBL7525583 | 0.76 | — | — | |
| SCHEMBL394351 | 0.76 | — | — | |
| SCHEMBL7517021 | 0.76 | — | — | |
| SCHEMBL7521276 | 0.76 | — | — | |
| SCHEMBL7528291 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8062429-B2 | Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions | EKC TECHNOLOGY, INC. (US) | 2011-11-22 | — | — | US | disclosed |
| US-20100105595-A1 | COMPOSITION COMPRISING CHELATING AGENTS CONTAINING AMIDOXIME COMPOUNDS | EKC TECHNOLOGY, INC. | 2010-04-29 | — | — | US | disclosed |
| US-20100043823-A1 | METHODS OF CLEANING SEMICONDUCTOR DEVICES AT THE BACK END OF LINE USING AMIDOXIME COMOSITIONS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2010-02-25 | — | — | US | disclosed |
| WO-2009085072-A1 | COMPOSITION COMPRISING CHELATING AGENTS CONTAINING AMIDOXIME COMPOUNDS | EKC TECHNOLOGY, INC (US) | 2009-07-09 | — | — | WO | disclosed |
| US-20090137191-A1 | COPPER CMP POLISHING PAD CLEANING COMPOSITION COMPRISING OF AMIDOXIME COMPOUNDS | EKC TECHNOLOGY, INC. | 2009-05-28 | — | — | US | disclosed |
| US-20090133716-A1 | METHODS OF POST CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING USING AMIDOXIME COMPOSITIONS | EKC TECHNOLOGY, INC. | 2009-05-28 | — | — | US | disclosed |
| US-20090130849-A1 | CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE | EKC TECHNOLOGY, INC. | 2009-05-21 | — | — | US | disclosed |
| WO-2009058274-A1 | CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| WO-2009058278-A1 | METHODS OF CLEANING SEMICONDUCTOR DEVICES AT THE BACK END OF LINE USING AMIDOXIME COMPOSITIONS | EKC TECHNOLOGY, INC (US) | 2009-05-07 | — | — | WO | disclosed |
| WO-2009058275-A1 | METHODS OF POST CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING USING AMIDOXIME COMPOSITIONS | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| WO-2009058288-A1 | AMIDOXIME COMPOUNDS AS CHELATING AGENTS IN SEMICONDUCTOR PROCESSES | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| WO-2009058272-A1 | COPPER CMP POLISHING PAD CLEANING COMPOSITION COMPRISING OF AMIDOXIME COMPOUNDS | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| US-20090107520-A1 | AMIDOXIME COMPOUNDS AS CHELATING AGENTS IN SEMICONDUCTOR PROCESSES | EKC TECHNOLOGY, INC. | 2009-04-30 | — | — | US | disclosed |