SCHEMBL1344650

SCHEMBL1344650

CC(c1ccccc1)c1ccc(O)c(Cc2cc(C(C)c3ccccc3)cc(Cc3cc(C(C)c4ccccc4)ccc3O)c2O)c1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AMY1A P0DUB6 1/20 0.47
HIF1A Q16665 3/20 0.44
CYP2C9 P11712 1/20 0.44
CYP2C19 P33261 1/20 0.44
TYR P14679 1/20 0.41
LMNA P02545 2/20 0.40
ALDH1A1 P00352 1/20 0.40
TSHR P16473 1/20 0.40
MEN1 O00255 2/20 0.38
CYP3A4 P08684 2/20 0.38
HPGD P15428 2/20 0.38
ALOX15 P16050 2/20 0.38
KMT2A Q03164 2/20 0.38
HSD17B10 Q99714 1/20 0.38
HKDC1 Q2TB90 1/20 0.38
HSPA5 P11021 2/20 0.37
ESR1 P03372 1/20 0.37
PDCD1 Q15116 1/20 0.37
ESR2 Q92731 1/20 0.37
CD274 Q9NZQ7 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5712109 1.00 AMY1A (0.47) AMY1AHIF1ACYP2C9CYP2C19TYR
SCHEMBL5712084 1.00 AMY1A (0.47) AMY1AHIF1ACYP2C9CYP2C19TYR
SCHEMBL1345128 0.94 TYR (0.46) AMY1AHIF1ACYP2C9CYP2C19TYR
SCHEMBL8345110 0.83 AMY1A (0.55) AMY1AHIF1ACYP2C9CYP2C19TYR
SCHEMBL10869295 0.82 BCL2 (0.48) HIF1ATYRMEN1CYP3A4HPGD
SCHEMBL1345461 0.78 AMY1A (0.55) AMY1AHIF1ACYP2C9CYP2C19TYR
SCHEMBL1345703 0.78 AMY1A (0.55) AMY1AHIF1ACYP2C9CYP2C19TYR
SCHEMBL1345280 0.78 AMY1A (0.55) AMY1AHIF1ACYP2C9CYP2C19TYR
SCHEMBL5533891 0.78 TYR (0.43) TYRLMNAALDH1A1HPGDHSD17B10
SCHEMBL10907289 0.78 BCL2 (0.52) HIF1AMEN1CYP3A4HPGDALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1724119-B1 DEVELOPER MIXTURE FOR THERMAL RECORDING MATERIALS AND THERMAL RECORDING MATERIALS MITSUBISHI CHEM CORP (JP) 2014-11-19 EP disclosed
US-8062993-B2 Developer mixture for thermal recording materials and thermal recording materials API CORPORATION (JP) 2011-11-22 US disclosed
US-20070173407-A1 Developer mixture for thermal recording materials and thermal recording materials API CORPORATION (JP) 2007-07-26 US disclosed
EP-1724119-A1 DEVELOPER MIXTURE FOR THERMAL RECORDING MATERIALS AND THERMAL RECORDING MATERIALS API Corporation (JP) 2006-11-22 EP disclosed