⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL27681124 | 0.82 | CES1 (0.59) | — | |
| SCHEMBL28219111 | 0.77 | — | — | |
| SCHEMBL4264798 | 0.77 | — | — | |
| SCHEMBL108642 | 0.75 | CES1 (1.00) | — | |
| SCHEMBL19597529 | 0.72 | — | — | |
| SCHEMBL27387905 | 0.72 | — | — | |
| Bicarbonate SCHEMBL6624249 | 0.72 | SPHK2 (0.50) | — | |
| Butyric Acid SCHEMBL1070683 | 0.72 | FFAR3 (0.72) | — | |
| SCHEMBL21051781 | 0.72 | CES2 (0.44) | — | |
| SCHEMBL4945697 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8062429-B2 | Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions | EKC TECHNOLOGY, INC. (US) | 2011-11-22 | — | — | US | disclosed |
| US-20100105595-A1 | COMPOSITION COMPRISING CHELATING AGENTS CONTAINING AMIDOXIME COMPOUNDS | EKC TECHNOLOGY, INC. | 2010-04-29 | — | — | US | disclosed |
| US-20100043823-A1 | METHODS OF CLEANING SEMICONDUCTOR DEVICES AT THE BACK END OF LINE USING AMIDOXIME COMOSITIONS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2010-02-25 | — | — | US | disclosed |
| US-20090137191-A1 | COPPER CMP POLISHING PAD CLEANING COMPOSITION COMPRISING OF AMIDOXIME COMPOUNDS | EKC TECHNOLOGY, INC. | 2009-05-28 | — | — | US | disclosed |
| US-20090133716-A1 | METHODS OF POST CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING USING AMIDOXIME COMPOSITIONS | EKC TECHNOLOGY, INC. | 2009-05-28 | — | — | US | disclosed |
| US-20090130849-A1 | CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE | EKC TECHNOLOGY, INC. | 2009-05-21 | — | — | US | disclosed |