SCHEMBL134849

SCHEMBL134849

C=C(C)C(=O)[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methacrylic Acid SCHEMBL31321258 0.89 TDP1 (0.42)
SCHEMBL16063 0.73
SCHEMBL8835058 0.73
SCHEMBL8810584 0.73
SCHEMBL621052 0.71
SCHEMBL1765793 0.71
Methacrylic Acid SCHEMBL11235035 0.70 TDP1 (0.53)
Methacrylic Acid SCHEMBL491341 0.70 TDP1 (0.53)
Methacrylic Acid SCHEMBL13234423 0.70
Methacrylic Acid SCHEMBL15005463 0.70 TDP1 (0.53)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2869 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4223809-B1 USE OF A (METH)ACRYLIC COMPOSITION FOR MANUFACTURING A DIELECTRIC MATERIAL AND ASSOCIATED MANUFACTURING METHOD SCHNEIDER ELECTRIC IND SAS (FR) 2026-05-06 EP claimed
US-12419906-B2 Compositions and methods for application over skin SHISEIDO COMPANY, LIMITED (JP) 2025-09-23 US claimed
WO-2025121410-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE パナソニックIPマネジメント株式会社 2025-06-12 WO claimed
WO-2025110104-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE パナソニックIPマネジメント株式会社 2025-05-30 WO claimed
WO-2025110106-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE パナソニックIPマネジメント株式会社 2025-05-30 WO claimed
EP-3511950-B1 ENAMELLED WIRE SCHWERING & HASSE ELEKTRODRAHT GMBH (DE) 2025-02-26 EP claimed
WO-2025028480-A1 THERMOSETTING COMPOSITION, METHOD FOR PRODUCING MOLDED ARTICLE USING SAME, AND CURED PRODUCT 出光興産株式会社 2025-02-06 WO claimed
WO-2025028482-A1 THERMOSETTING COMPOSITION, METHOD FOR PRODUCING MOLDED ARTICLE USING SAME, AND CURED PRODUCT 出光興産株式会社 2025-02-06 WO claimed
WO-2025028473-A1 THERMOSETTING COMPOSITION, METHOD FOR PRODUCING MOLDED ARTICLE USING SAME, AND CURED PRODUCT 出光興産株式会社 2025-02-06 WO claimed
WO-2025018138-A1 SURFACE-TREATED GLASS CLOTH, PREPREG AND PRINTED WIRING BOARD 日東紡績株式会社 2025-01-23 WO claimed
EP-0481115-B1 Process for improving the adhesion of plastics to metals RAUTER VITA ZAHNFABRIK (DE) 1994-01-05 EP claimed
EP-0370326-B1 METHOD FOR THE TREATMENT OF FIBROUS MATERIALS WITH MODIFIED ORGANOPOLYSILOXANES, AND MATERIALS SO TREATED Pfersee Chemie GmbH (DE) 1993-08-04 EP claimed
EP-0333464-B1 POLYMER CLADDINGS FOR OPTICAL FIBRE WAVEGUIDES MINNESOTA MINING & MFG (US) 1993-05-12 EP claimed
EP-0443051-B1 METHOD OF PRODUCING A GLASS-FIBRE POLYESTER COMPOSITE THERMOSETTING MOULDING MATERIAL AND APPARATUS FOR CARRYING OUT THE PROCESS FIBRON Gesellschaft mit beschränkter Haftung (DE) 1993-04-21 EP claimed
US-5153068-A Discoloration inhibition SEKISUI FINE CHEMICAL CO., LTD. (JP) 1992-10-06 US claimed
EP-0443051-A1 Method of producing a glass-fibre polyester composite thermosetting moulding material and apparatus for carrying out the process FIBRON Gesellschaft mit beschränkter Haftung (DE) 1991-08-28 EP claimed
EP-0010121-B1 PREFABRICATED SELF-SUPPORTING PANELS AND METHOD OF MANUFACTURING SAME PANTEC S.r.l. (IT) 1983-04-20 EP claimed
US-4348452-A UNSATURATED POLYESTER AND CLAY FILLER WITH AN ORGANOSILANE COUPLER PANTEC S.R.L. (IT) 1982-09-07 US claimed
US-4268574-A UNSATURATED POLYESTERS, ALUMINUM PHYLOSILICATE, AND AN ORGANOFUNCTIONAL SILANE COUPLER PANTEC S.R.L. (IT) 1981-05-19 US claimed
EP-0010121-A1 Prefabricated self-supporting panels and method of manufacturing same PANTEC S.r.l. (IT) 1980-04-30 EP claimed