Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | PPM1B | O75688 | 2/20 | 0.31 |
| ▸ | PTPN1 | P18031 | 2/20 | 0.31 |
| ▸ | PPP1CC | P36873 | 2/20 | 0.31 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.30 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.30 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.30 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.30 |
| ▸ | CHRNA4 | P43681 | 1/20 | 0.30 |
| ▸ | HTR3A | P46098 | 1/20 | 0.30 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1355027 | 0.91 | TSHR (0.36) | — | |
| SCHEMBL1357327 | 0.89 | ALDH1A1 (0.33) | ALDH1A1PPM1BPTPN1PPP1CC | |
| SCHEMBL1356970 | 0.81 | TSHR (0.32) | PPM1BPTPN1PPP1CCCHRM2CHRM1 | |
| SCHEMBL28167831 | 0.80 | ALDH1A1 (0.33) | ALDH1A1CHRM2CHRM1CHRM3ADRA1A | |
| SCHEMBL1357349 | 0.79 | ALDH1A1 (0.33) | ALDH1A1 | |
| SCHEMBL21196520 | 0.74 | ALDH1A1 (0.44) | ALDH1A1 | |
| SCHEMBL26908644 | 0.74 | ALDH1A1 (0.35) | ALDH1A1 | |
| SCHEMBL12056568 | 0.72 | TSHR (0.44) | ALDH1A1PPM1BPTPN1PPP1CC | |
| SCHEMBL27904060 | 0.70 | — | — | |
| SCHEMBL1357908 | 0.69 | PPM1B (0.31) | PPM1BPTPN1PPP1CC |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-104726032-B | Adhesive film, dicing die-bonding film, method for manufacturing semiconductor device, and semiconductor device | 日东电工株式会社 | 2020-08-11 | — | — | CN | disclosed |
| CN-105988155-B | Polarizing plate protective film, polarizing plate, liquid crystal display device, and method for producing polarizing plate protective film | 富士胶片株式会社 | 2020-07-14 | — | — | CN | disclosed |
| CN-107076879-B | The manufacturing method and hard-coated film of hard-coated film | 富士胶片株式会社 | 2019-03-01 | — | — | CN | disclosed |
| US-10155870-B2 | Method for manufacturing hardcoat film and hardcoat film | FUJIFILM CORPORATION (JP) | 2018-12-18 | — | — | US | disclosed |
| CN-105075409-B | Solder resist composition and printed wiring board using the same | 太阳控股株式会社 | 2018-07-03 | — | — | CN | disclosed |
| CN-104808436-B | Alkali development-type photosensitive resin composition, dry film and solidfied material and printed circuit board (PCB) | 太阳油墨（苏州）有限公司 | 2017-11-24 | — | — | CN | disclosed |
| CN-107076879-A | The manufacture method and hard-coated film of hard-coated film | 富士胶片株式会社 | 2017-08-18 | — | — | CN | disclosed |
| US-20170183503-A1 | METHOD FOR MANUFACTURING HARDCOAT FILM AND HARDCOAT FILM | FUJIFILM CORPORATION (JP) | 2017-06-29 | — | — | US | disclosed |
| CN-106716251-A | Photosensitive resin composition, dry film and cured coating film thereof, and printed wiring board using same | 太阳油墨制造株式会社 | 2017-05-24 | — | — | CN | disclosed |
| CN-103777465-B | Curing resin composition, cured film, and printed circuit board | 太阳油墨制造株式会社 | 2017-04-12 | — | — | CN | disclosed |
| CN-102004394-A | Solder resist composition and printed wiring board | TAIYO INK MFG CO LTD | 2011-04-06 | — | — | CN | disclosed |
| CN-102006717-A | Solder resist layer and printed circuit board | TAIYO INK MFG CO LTD | 2011-04-06 | — | — | CN | disclosed |
| CN-101980081-A | Solder resist composition and printed wiring board | TAIYO HOLDINGS CO LTD | 2011-02-23 | — | — | CN | disclosed |
| CN-101866108-A | Photosetting and thermosetting solder resist composition and the printed-wiring board (PWB) that uses it | TAIYO INK MFG CO LTD | 2010-10-20 | — | — | CN | disclosed |
| CN-101082773-B | Photocurable/thermosetting solder resist composition and printed wiring board using same | TAIYO INK MFG CO LTD | 2010-08-11 | — | — | CN | disclosed |
| CN-101699351-A | Solder resist composition and printing circuit board formed thereby | TAIYO INK MFG CO LTD | 2010-04-28 | — | — | CN | disclosed |
| CN-101356475-A | Photocurable/thermocurable solder resist composition, and printed circuit board using the same | TAIYO INK MFG CO LTD (JP) | 2009-01-28 | — | — | CN | disclosed |
| CN-101169590-A | Photocurable/thermosetting resin composition and printed wiring board using same | TAIYO INK MFG CO LTD (JP) | 2008-04-30 | — | — | CN | disclosed |
| CN-101105629-A | Light solidifying/heat solidifying one-part welding resistant agent composition and printing circuit plate | TAIYO INK MFG CO LTD (JP) | 2008-01-16 | — | — | CN | disclosed |
| CN-101082773-A | Photocurable/thermosetting solder resist composition and printed wiring board using same | UNIV KANAGAWA (JP) | 2007-12-05 | — | — | CN | disclosed |