SCHEMBL1361465

SCHEMBL1361465

Nc1ccccc1Oc1ccccc1C(=O)c1ccccc1C(=O)c1ccccc1Oc1ccccc1N

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CTNNB1 P35222 1/20 0.46
GAA P10253 3/20 0.46
MAPT P10636 2/20 0.46
KDM4E B2RXH2 2/20 0.46
CRHBP P24387 1/20 0.46
CRHR2 Q13324 1/20 0.46
ELANE P08246 1/20 0.44
HTT P42858 1/20 0.44
ALDH1A1 P00352 7/20 0.44
HSD17B10 Q99714 4/20 0.44
CFTR P13569 1/20 0.44
ADRA2B P18089 1/20 0.42
PTGS1 P23219 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
RCE1 Q9Y256 2/20 0.42
MAPK13 O15264 1/20 0.41
MAPK12 P53778 1/20 0.41
MAPK11 Q15759 1/20 0.41
MAPK14 Q16539 1/20 0.41
LMNA P02545 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4575087 0.98 CTNNB1 (0.47) CTNNB1GAAMAPTKDM4ECRHBP
SCHEMBL28499859 0.87 MAPT (0.65) CTNNB1GAAMAPTELANEHTT
SCHEMBL2191708 0.85 HTT (0.62) CTNNB1GAAMAPTKDM4ECRHBP
SCHEMBL1363156 0.82 CTNNB1 (0.53) CTNNB1GAAMAPTKDM4EHTT
SCHEMBL28269890 0.81 IKBKB (0.50) CTNNB1GAAMAPTKDM4EHTT
SCHEMBL28269880 0.81 IKBKB (0.46) CTNNB1GAAMAPTKDM4EHTT
SCHEMBL8075174 0.80 ALDH1A1 (0.68) GAAMAPTKDM4EHTTALDH1A1
SCHEMBL12165503 0.80 CTNNB1 (0.64) CTNNB1GAAMAPTKDM4EALDH1A1
SCHEMBL8586968 0.78 MAPT (0.49) CTNNB1GAAMAPTKDM4EELANE
SCHEMBL30979203 0.78 KDM4E (0.65) GAAMAPTKDM4ECRHBPCRHR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-2178325-A None JP disclosed
US-8067523-B2 Thermosetting resin composition, laminated body using it, and circuit board KANEKA CORPORATION (JP) 2011-11-29 US disclosed
US-7838114-B2 flexible printed circuits; dielectric, flowability, heat resistance, adhesiveness, and processability; a polyimide resin, an monomeric aromatic amine, an epoxy resin (polyepoxide), and an imidazole compound; 1,3-bis(3-aminophenoxy)benzene KANEKA CORPORATION (JP) 2010-11-23 US disclosed
US-20080230261-A1 Thermosetting Resin Composition and Use Thereof KANEKA CORPORATION (JP) 2008-09-25 US disclosed
US-20070074896-A1 Thermosetting resin composition, laminated body using it, and circuit board KANEKA CORPORATION (JP) 2007-04-05 US disclosed
JP-H02178325-A PRODUCTION OF POLYIMIDE HAVING GOOD THERMAL STABILITY MITSUI TOATSU CHEM INC 1990-07-11 JP disclosed