Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOB | P27338 | 1/20 | 0.70 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.61 |
| ▸ | MEN1 | O00255 | 3/20 | 0.61 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.61 |
| ▸ | MAPT | P10636 | 2/20 | 0.61 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.61 |
| ▸ | MITF | O75030 | 1/20 | 0.61 |
| ▸ | GAA | P10253 | 1/20 | 0.61 |
| ▸ | GFER | P55789 | 1/20 | 0.61 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.61 |
| ▸ | NOD2 | Q9HC29 | 1/20 | 0.61 |
| ▸ | LTA4H | P09960 | 2/20 | 0.59 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.59 |
| ▸ | BAX | Q07812 | 1/20 | 0.59 |
| ▸ | ESR1 | P03372 | 1/20 | 0.56 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.56 |
| ▸ | POLB | P06746 | 1/20 | 0.52 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.52 |
| ▸ | ATM | Q13315 | 1/20 | 0.51 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9806882 | 0.98 | MAOB (0.68) | MAOBALDH1A1MEN1KMT2AMAPT | |
| SCHEMBL204267 | 0.89 | MAOB (0.86) | MAOBALDH1A1MEN1KMT2AMAPT | |
| SCHEMBL128748 | 0.89 | MAOB (0.86) | MAOBALDH1A1MEN1KMT2AMAPT | |
| SCHEMBL29363390 | 0.89 | MAOB (0.86) | MAOBALDH1A1MEN1KMT2AMAPT | |
| SCHEMBL29352463 | 0.89 | MAOB (0.86) | MAOBALDH1A1MEN1KMT2AMAPT | |
| SCHEMBL1270913 | 0.89 | MAOB (0.86) | MAOBALDH1A1MEN1KMT2AMAPT | |
| SCHEMBL28478542 | 0.88 | ALDH1A1 (0.80) | MAOBALDH1A1MEN1KMT2AMAPT | |
| SCHEMBL6290749 | 0.87 | MAOB (0.83) | MAOBALDH1A1MEN1KMT2AMAPT | |
| SCHEMBL6290567 | 0.87 | MAOB (0.83) | MAOBALDH1A1MEN1KMT2AMAPT | |
| SCHEMBL6293819 | 0.87 | MAOB (0.83) | MAOBALDH1A1MEN1KMT2AMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 278 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118255988-A | Polyimide molded article and method for producing same | 聚酰亚胺先端材料有限公司 | 2024-06-28 | — | — | CN | claimed |
| CN-112955497-B | Ultrathin polyimide film with improved dimensional stability and preparation method thereof | 聚酰亚胺先端材料有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-116333674-A | PI adhesive, PI film and warping-resistant FCCL product prepared from PI adhesive and PI film | 广州方邦电子股份有限公司 | 2023-06-27 | — | — | CN | claimed |
| CN-112955497-A | Ultrathin polyimide film with improved dimensional stability and preparation method thereof | 聚酰亚胺先端材料有限公司 | 2021-06-11 | — | — | CN | claimed |
| CN-112346273-A | Flexible liquid crystal display device | 旭化成株式会社 | 2021-02-09 | — | — | CN | claimed |
| EP-0418889-B1 | Polyamic acid having three-dimensional network molecular structure, polyimide obtained therefrom and process for the preparation thereof | TOHO RAYON KK (JP) | 1997-02-05 | — | — | EP | claimed |
| CN-118339218-A | Film, method for producing the same, and image display device | 株式会社钟化 | 2024-07-12 | — | — | CN | disclosed |
| CN-114846082-B | Resin composition and film | 株式会社钟化 | 2024-07-12 | — | — | CN | disclosed |
| CN-114072451-B | Polyamic acid composition, method for preparing the same, and polyimide containing the same | PI尖端素材株式会社 | 2024-07-02 | — | — | CN | disclosed |
| CN-118271355-A | Polyimide precursor, polyimide and application thereof | 深圳先进电子材料国际创新研究院 | 2024-07-02 | — | — | CN | disclosed |
| CN-113950409-B | Laminate body | 东洋纺株式会社 | 2024-06-28 | — | — | CN | disclosed |
| CN-118255988-A | Polyimide molded article and method for producing same | 聚酰亚胺先端材料有限公司 | 2024-06-28 | — | — | CN | disclosed |
| CN-118244583-A | Negative photosensitive polyimide precursor resin composition | 深圳先进电子材料国际创新研究院 | 2024-06-25 | — | — | CN | disclosed |
| US-20090136725-A1 | PROCESS FOR PRODUCING COPPER WIRING POLYIMIDE FILM, AND COPPER WIRING POLYIMIDE FILM | UBE INDUSTRIES, LTD. (JP) | 2009-05-28 | — | — | US | disclosed |
| US-20070100129-A1 | Low expansion polyimide, resin composition and article using thereof | DAI NIPPON PRINTING CO., LTD (JP) | 2007-05-03 | — | — | US | disclosed |
| US-20070074896-A1 | Thermosetting resin composition, laminated body using it, and circuit board | KANEKA CORPORATION (JP) | 2007-04-05 | — | — | US | disclosed |
| US-5283313-A | Blocked with dicarboxylic acid anhydride | MITSUI TOATSU CHEMICALS, INC. (JP) | 1994-02-01 | — | — | US | disclosed |
| US-5268446-A | Melt processable; end blocked with phthalic anhydride | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1993-12-07 | — | — | US | disclosed |
| US-5231160-A | AROMATIC DIAMINE COMPOUND, PREPARATION PROCESS OF SAME AND POLYIMIDE PREPARED FROM SAME | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1993-07-27 | — | — | US | disclosed |
| US-5196506-A | Heat resistance | MITSUI TOATSU CHEMICALS, INC. (JP) | 1993-03-23 | — | — | US | disclosed |