SCHEMBL13656902

SCHEMBL13656902

CCCCN(CCCC)P(=O)(c1ccccc1)c1ccccc1

nearest known ligand 0.59

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 2/20 0.59
MEN1 O00255 2/20 0.59
KMT2A Q03164 2/20 0.59
KCNA5 P22460 6/20 0.47
KCNN4 O15554 3/20 0.45
TDP1 Q9NUW8 1/20 0.44
MAPT P10636 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8862371 0.93 NPSR1 (0.51) NPSR1MEN1KMT2AKCNA5KCNN4
SCHEMBL11138881 0.85 NPSR1 (0.59) NPSR1MEN1KMT2AKCNA5TDP1
SCHEMBL14288550 0.84 MEN1 (0.47) NPSR1MEN1KMT2AKCNA5
SCHEMBL14304254 0.80 KCNA5 (0.49) NPSR1MEN1KMT2AKCNA5KCNN4
SCHEMBL14304788 0.79 MMP1 (0.48) NPSR1MEN1KMT2AKCNA5MAPT
SCHEMBL14493542 0.78 NPSR1 (0.51) NPSR1MEN1KMT2AMAPT
SCHEMBL11142922 0.78 MEN1 (0.51) NPSR1MEN1KMT2A
SCHEMBL14303128 0.77 MMP1 (0.49) NPSR1MEN1KMT2AKCNA5MAPT
SCHEMBL14303126 0.77 MMP1 (0.49) NPSR1MEN1KMT2AKCNA5MAPT
SCHEMBL29089044 0.76 NPSR1 (0.47) NPSR1MEN1KMT2AKCNA5KCNN4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 210 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20190235376-A1 THERMALLY-DEVELOPABLE PHOTOSENSITIVE MATERIAL AND PREPARATION METHOD THEREOF FUJIFILM CORPORATION (JP) 2019-08-01 US disclosed
US-7608391-B2 Photothermographic material FUJIFILM CORPORATION (JP) 2009-10-27 US disclosed
US-7608391-B2 Photothermographic material FUJIFILM CORPORATION (JP) 2009-10-27 US disclosed
US-7497107-B2 Gas sensing material and gas inspecting method FUJI PHOTO FILM CO., LTD. (JP) 2009-03-03 US disclosed
US-7497107-B2 Gas sensing material and gas inspecting method FUJI PHOTO FILM CO., LTD. (JP) 2009-03-03 US disclosed
US-20090023103-A1 SOLID DISPERSION, PROCESS OF PRODUCING SOLID DISPERSION, AND HEAT DEVELOPABLE PHOTOSENSITIVE MATERIAL FUJIFILM CORPORATION (JP) 2009-01-22 US disclosed
US-20090023103-A1 SOLID DISPERSION, PROCESS OF PRODUCING SOLID DISPERSION, AND HEAT DEVELOPABLE PHOTOSENSITIVE MATERIAL FUJIFILM CORPORATION (JP) 2009-01-22 US disclosed
US-7465533-B2 Photothermographic material and an image forming method FUJIFILM CORPORPORATION (JP) 2008-12-16 US disclosed
US-7465533-B2 Photothermographic material and an image forming method FUJIFILM CORPORPORATION (JP) 2008-12-16 US disclosed
US-7462444-B2 Image forming method for the photothermographic material FUJIFILM CORPORATION (JP) 2008-12-09 US disclosed
US-7157217-B2 Photothermographic material FUJIFILM CORPORATION (JP) 2007-01-02 US disclosed
US-7157217-B2 Photothermographic material FUJIFILM CORPORATION (JP) 2007-01-02 US disclosed
US-7157220-B2 Silver halide photosensitive material and photothermographic material FUJIFILM CORPORATION (JP) 2007-01-02 US disclosed
US-7157220-B2 Silver halide photosensitive material and photothermographic material FUJIFILM CORPORATION (JP) 2007-01-02 US disclosed
US-7157218-B2 Suppressed fogging and printout and is excellent in storage stability of an image against stain FUJIFILM CORPORATION (JP) 2007-01-02 US disclosed
US-7157218-B2 Suppressed fogging and printout and is excellent in storage stability of an image against stain FUJIFILM CORPORATION (JP) 2007-01-02 US disclosed
US-7158164-B2 Thermal development method and apparatus FUJI PHOTO FILM CO., LTD. (JP) 2007-01-02 US disclosed
US-7157665-B2 Heat development apparatus and method FUJI PHOTO FILM CO., LTD. (JP) 2007-01-02 US disclosed
US-7157665-B2 Heat development apparatus and method FUJI PHOTO FILM CO., LTD. (JP) 2007-01-02 US disclosed
US-7158164-B2 Thermal development method and apparatus FUJI PHOTO FILM CO., LTD. (JP) 2007-01-02 US disclosed