SCHEMBL13675131

SCHEMBL13675131

CCC(C)(C)OC(C)C(=O)C(C)(CC)CC

nearest known ligand 0.32

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.32
TSHR P16473 1/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10820456 0.85
SCHEMBL13179981 0.85
SCHEMBL14045275 0.83 ALDH1A1 (0.32) ALDH1A1TSHRTDP1
SCHEMBL16984724 0.80 ALDH1A1 (0.39) ALDH1A1TSHRTDP1
SCHEMBL3056241 0.78 TDP1 (0.35) ALDH1A1TSHRTDP1
SCHEMBL6668901 0.78 TDP1 (0.35) ALDH1A1TSHRTDP1
SCHEMBL2636365 0.78 TDP1 (0.35) ALDH1A1TSHRTDP1
SCHEMBL12646465 0.77 ALDH1A1 (0.33) ALDH1A1TSHRTDP1
SCHEMBL13186162 0.73
SCHEMBL11430316 0.72 TSHR (0.31) TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1983030-B1 RESIN COMPOSITION, MOLDED ARTICLE AND THEIR PRODUCTION METHODS TEIJIN CHEMICALS LTD (JP) 2014-10-15 EP disclosed
US-7598305-B2 Resin composition, resin molding, package, production method of resin molding and recycling method of resin molding FUJI XEROX CO., LTD. (JP) 2009-10-06 US disclosed