⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Formic Acid SCHEMBL10514267 | 0.94 | — | — | |
| Formic Acid SCHEMBL8367149 | 0.94 | — | — | |
| Formic Acid SCHEMBL4302038 | 0.93 | ALDH1A1 (0.38) | — | |
| Formic Acid SCHEMBL20488608 | 0.88 | — | — | |
| Formic Acid SCHEMBL3471016 | 0.88 | — | — | |
| Formic Acid SCHEMBL1191534 | 0.86 | — | — | |
| Formic Acid SCHEMBL20636861 | 0.86 | — | — | |
| Formic Acid SCHEMBL887020 | 0.86 | — | — | |
| Formic Acid SCHEMBL21268119 | 0.86 | ALDH1A1 (0.33) | — | |
| Formic Acid SCHEMBL2354 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114391169-B | Silver sintered preparation and use thereof for connecting electronic components | 贺利氏电子有限两合公司 | 2025-02-28 | — | — | CN | claimed |
| CN-116949437-A | Copper surface chemical silver plating solution, preparation method and use method thereof and silver plating layer | 吉安宏达秋科技有限公司 | 2023-10-27 | — | — | CN | claimed |
| CN-114391169-A | Silver sintered preparation and use thereof for connecting electronic components | 贺利氏德国有限两合公司 | 2022-04-22 | — | — | CN | claimed |
| US-10910340-B1 | Silver sintering preparation and the use thereof for the connecting of electronic components | Heraeus Deutschland GmbH & Co. KG (DE) | 2021-02-02 | — | — | US | claimed |
| EP-2428293-B1 | contacting medium and process for contacting electrical parts | HERAEUS DEUTSCHLAND GMBH & CO KG (DE) | 2017-11-01 | — | — | EP | claimed |
| EP-2396139-B2 | METAL PASTE WITH CO-PRECURSORS | HERAEUS DEUTSCHLAND GMBH & CO KG (DE) | 2017-08-02 | — | — | EP | claimed |
| US-8925789-B2 | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2015-01-06 | — | — | US | claimed |
| EP-2396139-B1 | METAL PASTE WITH CO-PRECURSORS | HERAEUS MATERIALS TECH GMBH (DE) | 2014-05-07 | — | — | EP | claimed |
| US-20120153012-A1 | METAL PASTE WITH CO-PRECURSORS | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-06-21 | — | — | US | claimed |
| US-20120055978-A1 | Contacting Means and Method for Contacting Electrical Components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-03-08 | — | — | US | claimed |
| CN-116949437-B | Copper surface chemical silver plating solution, preparation method and use method thereof and silver plating layer | 吉安宏达秋科技有限公司 | 2025-08-26 | — | — | CN | disclosed |
| US-20250210573-A1 | METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF COMPONENTS | HERAEUS ELECTRONICS GMBH & CO. KG (DE) | 2025-06-26 | — | — | US | disclosed |
| CN-114391169-B | Silver sintered preparation and use thereof for connecting electronic components | 贺利氏电子有限两合公司 | 2025-02-28 | — | — | CN | disclosed |
| EP-4414122-A1 | SOLDERABLE ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME | Infineon Technologies AG (DE) | 2024-08-14 | — | — | EP | disclosed |
| US-20240266311-A1 | SOLDERABLE ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME | INFINEON TECHNOLOGIES AG (DE) | 2024-08-08 | — | — | US | disclosed |
| US-20150021378-A1 | METHOD OF JOINING COMPONENTS USING METAL PASTE WITH OXIDIZING AGENTS | Heraeus Deutschland GmbH & Co. KG (DE) | 2015-01-22 | — | — | US | disclosed |
| US-8925789-B2 | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2015-01-06 | — | — | US | disclosed |
| US-20120153012-A1 | METAL PASTE WITH CO-PRECURSORS | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-06-21 | — | — | US | disclosed |
| US-20120153011-A1 | METAL PASTE WITH OXIDIZING AGENTS | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-06-21 | — | — | US | disclosed |
| US-20120055978-A1 | Contacting Means and Method for Contacting Electrical Components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-03-08 | — | — | US | disclosed |