⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12013722 | 1.00 | — | — | |
| SCHEMBL13856047 | 0.73 | — | — | |
| SCHEMBL13744326 | 0.72 | — | — | |
| SCHEMBL10115763 | 0.69 | — | — | |
| SCHEMBL4974894 | 0.69 | — | — | |
| SCHEMBL14272316 | 0.68 | — | — | |
| SCHEMBL18455469 | 0.67 | — | — | |
| SCHEMBL19400623 | 0.65 | — | — | |
| SCHEMBL18634197 | 0.63 | HSD11B1 (0.31) | — | |
| SCHEMBL75117 | 0.63 | HSD11B1 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9086628-B2 | Resist protective film-forming composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-07-21 | — | — | US | disclosed |
| US-20130084517-A1 | RESIST PROTECTIVE FILM-FORMING COMPOSITION AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-04-04 | — | — | US | disclosed |
| US-20130034813-A1 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION FOR ArF IMMERSION LITHOGRAPHY AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-02-07 | — | — | US | disclosed |
| US-7378218-B2 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-05-27 | — | — | US | disclosed |
| US-20080038664-A1 | Silsesquioxane compound mixture, method of making, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 2008-02-14 | — | — | US | disclosed |