SCHEMBL14265459

SCHEMBL14265459

CO[Si](C)(C)CCC(F)(F)C(F)(F)C(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14265460 0.94
SCHEMBL14265464 0.92
SCHEMBL30277230 0.92
SCHEMBL30277176 0.92
SCHEMBL5349532 0.92
SCHEMBL10529773 0.86
SCHEMBL3740304 0.80
SCHEMBL14265492 0.79
SCHEMBL10412067 0.78
SCHEMBL6859814 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260018421-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD CENTRAL GLASS CO LTD (JP) 2026-01-15 US disclosed
US-20250343040-A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PRODUCTION METHOD CENTRAL GLASS CO LTD (JP) 2025-11-06 US disclosed
EP-4597547-A1 CHEMICAL SOLUTION, METHOD FOR PRODUCING MODIFIED SUBSTRATE, AND METHOD FOR PRODUCING LAYERED BODY FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
US-20250215024-A1 CHEMICAL LIQUID, MANUFACTURING METHOD OF MODIFIED SUBSTRATE, AND MANUFACTURING METHOD OF LAMINATE FUJIFILM CORPORATION (JP) 2025-07-03 US disclosed
WO-2025105151-A1 METHOD OF MANUFACTURING TREATED SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR FUJIFILM CORPORATION (JP) 2025-05-22 WO disclosed
EP-4535406-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD Central Glass Company, Limited (JP) 2025-04-09 EP disclosed
EP-4535405-A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PRODUCTION METHOD Central Glass Company, Limited (JP) 2025-04-09 EP disclosed
CN-119768898-A Chemical solution, method for producing modified substrate, and method for producing laminate 富士胶片株式会社 2025-04-04 CN disclosed
CN-113169060-B Chamfering part treating agent composition and method for manufacturing wafer 中央硝子株式会社 2025-04-01 CN disclosed
US-20250066621-A1 COMPOSITION FOR FILM FORMATION AND METHOD FOR MANUFACTURING SUBSTRATE CENTRAL GLASS COMPANY, LIMITED (JP) 2025-02-27 US disclosed
WO-2024070526-A1 CHEMICAL SOLUTION, METHOD FOR PRODUCING MODIFIED SUBSTRATE, AND METHOD FOR PRODUCING LAYERED BODY 富士フイルム株式会社 2024-04-04 WO disclosed
WO-2023234370-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD セントラル硝子株式会社 2023-12-07 WO disclosed
WO-2023234368-A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PRODUCTION METHOD セントラル硝子株式会社 2023-12-07 WO disclosed
US-11817310-B2 Bevel portion treatment agent composition and method of manufacturing wafer CENTRAL GLASS COMPANY, LIMITED (JP) 2023-11-14 US disclosed
US-20230282473-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATES AND SURFACE TREATMENT AGENT COMPOSITION CENTRAL GLASS COMPANY, LIMITED (JP) 2023-09-07 US disclosed
US-20230282474-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATES AND SURFACE TREATMENT AGENT COMPOSITION CENTRAL GLASS COMPANY, LIMITED (JP) 2023-09-07 US disclosed
WO-2023127942-A1 COMPOSITION FOR FILM FORMATION AND METHOD FOR PRODUCING SUBSTRATE セントラル硝子株式会社 2023-07-06 WO disclosed
EP-4155375-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATES, AND SURFACE TREATMENT AGENT COMPOSITION Central Glass Company, Limited (JP) 2023-03-29 EP disclosed
EP-4155376-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATE, AND SURFACE TREATMENT AGENT COMPOSITION Central Glass Company, Limited (JP) 2023-03-29 EP disclosed
US-7344235-B2 Ink composition for ink jet recording, ink cartridge, nozzle plate for ink jet recording, ink jet head, and recording apparatus MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2008-03-18 US disclosed