SCHEMBL1426682

SCHEMBL1426682

[CH2]C(C)O[C]=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9292 0.79
SCHEMBL634286 0.69
SCHEMBL15363944 0.69
SCHEMBL11280591 0.67
SCHEMBL11558655 0.67
SCHEMBL515487 0.67
SCHEMBL2954200 0.67
SCHEMBL98755 0.67
SCHEMBL227419 0.67
SCHEMBL514568 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 173 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110997873-A Photoalignment polymer material 罗利克技术有限公司 2020-04-10 CN claimed
US-7312200-B2 9-ketospinosyn derivatives BAYER CROPSCIENCE AG (DE) 2007-12-25 US claimed
US-20060128642-A1 9-Ketospinosyn derivatives BAYER CROPSCIENCE AG (DE) 2006-06-15 US claimed
US-6794111-B2 UNSATURATED TETRAHYDROFURAN DERIVATIVE MONOMERS AND THEIR PREPARATION E.G, 3,6-EPOXY-2,2-DIMETHYL-2,2A,3,6,6A,7-HEXAHYDROBENZO(C)FURAN SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-09-21 US claimed
US-12332565-B2 Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-06-17 US disclosed
US-11914295-B2 Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-02-27 US disclosed
US-11873468-B2 Polymers for the treatment of surfaces HENKEL AG & CO. KGAA (DE) 2024-01-16 US disclosed
US-11874563-B2 Photoaligning polymer materials Rolic Technologies AG (CH) 2024-01-16 US disclosed
CN-113412251-B Methods and compositions for preparing photoaligned polymeric materials 罗利克技术有限公司 2023-11-28 CN disclosed
US-20230333472-A1 THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-19 US disclosed
CN-116745265-A Process for producing heterocyclic amino acid compound 国立大学法人德岛大学 2023-09-12 CN disclosed
CN-111484540-B Compounds containing dinucleotide structures 博瑞生物医药(苏州)股份有限公司 2023-09-08 CN disclosed
EP-0559860-B1 HALOVINYL-DERIVATIVES HOFFMANN LA ROCHE (CH) 1996-02-14 EP disclosed
EP-0666508-A1 Crosslinked polyesterimide toner compositions XEROX CORPORATION (US) 1995-08-09 EP disclosed
US-5364556-A Halovinyl-derivatives HOFFMANN-LA ROCHE INC. (US) 1994-11-15 US disclosed
EP-0559860-A1 HALOVINYL-DERIVATIVES. HOFFMANN LA ROCHE (CH) 1993-09-15 EP disclosed
WO-1993007234-A1 HALOVINYL-DERIVATIVES F. HOFFMANN-LA ROCHE AG (CH) 1993-04-15 WO disclosed
US-4965155-A HIGH MOLECULAR WEIGHT POLYMERCONTAINING RHODANINE DERIVATIVE MITA INDUSTRIAL CO., LTD. (JP) 1990-10-23 US disclosed
US-4374194-A CATIONIC MORDANT FOR AN ANIONIC DYE; PHOTOPOLYMERIZABLE POLYESTERIONOMER; DEVELOPMENT BY WATER RISING; LIGHT SENSITIVE ELEMENTS EASTMAN KODAK COMPANY (US) 1983-02-15 US disclosed
US-4324722-A Water-soluble substituted aminocarbonyl monoazo dyestuffs BAYER AKTIENGESELLSCHAFT (DE) 1982-04-13 US disclosed