SCHEMBL1446233

SCHEMBL1446233

CC(O)[N+](=O)[O-].[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL844187 0.96
SCHEMBL1446238 0.93
Ammonia Solution, Strong SCHEMBL11501686 0.93
Acetic Acid SCHEMBL11076283 0.84 FFAR3 (0.41)
Alcohol SCHEMBL17054358 0.84
Dimethyl Sulfoxide SCHEMBL28115042 0.84 ALDH1A1 (0.33)
SCHEMBL10549230 0.76
SCHEMBL27546100 0.76
Isopropyl Alcohol SCHEMBL8215233 0.74
SCHEMBL734703 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8894828-B2 FIB process for selective and clean etching of copper Tiza Lab, LLC (US) 2014-11-25 US disclosed
US-20120211356-A1 FIB Process for Selective and Clean Etching of Copper TIZA LAB, L.L.C. 2012-08-23 US disclosed
EP-2470688-A1 FOCUSED ION BEAM PROCESS FOR SELECTIVE AND CLEAN ETCHING OF COPPER Tiza Lab, L.L.C. (US) 2012-07-04 EP disclosed
US-20110048931-A1 FIB Process for Selective and Clean Etching of Copper TIZA LAB, L.L.C. 2011-03-03 US disclosed
WO-2011025770-A1 FOCUSED ION BEAM PROCESS FOR SELECTIVE AND CLEAN ETCHING OF COPPER TIZA LAB, L.L.C. (US) 2011-03-03 WO disclosed
US-20110048929-A1 FIB Process for Selective and Clean Etching of Copper TIZA LAB, L.L.C., A LIMITED LIABILITY COMPANY OF THE STATE OF CALIFORNIA 2011-03-03 US disclosed