SCHEMBL14620451

SCHEMBL14620451

COc1cc(NC(=O)c2ccccc2)c(Cl)cc1N=N

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MEN1 O00255 3/20 0.56
▸ KMT2A Q03164 3/20 0.56
▸ MAPT P10636 4/20 0.56
▸ LMNA P02545 2/20 0.56
▸ KDM4E B2RXH2 4/20 0.54
▸ MAPK1 P28482 2/20 0.54
▸ HSD17B10 Q99714 1/20 0.54
▸ SMN1; SMN2 Q16637 4/20 0.53
▸ AHR P35869 1/20 0.53
▸ ALDH1A1 P00352 5/20 0.52
▸ CYP1A2 P05177 1/20 0.52
▸ CYP2C9 P11712 1/20 0.52
▸ CYP2C19 P33261 1/20 0.52
▸ NPSR1 Q6W5P4 1/20 0.51
▸ HPGD P15428 2/20 0.51
▸ NPY1R P25929 1/20 0.50
▸ NPY2R P49146 1/20 0.50
▸ RAB9A P51151 1/20 0.50
▸ PDE4D Q08499 1/20 0.50
▸ HDAC1 Q13547 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12166538 0.88 MEN1 (0.68) MEN1KMT2AMAPTKDM4EMAPK1
SCHEMBL14193695 0.86 MEN1 (0.58) MEN1KMT2AMAPTKDM4EMAPK1
SCHEMBL11985003 0.83 NPC1 (0.52) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL11691486 0.81 MEN1 (0.60) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL93011 0.78 KCNK9 (0.56) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL14588703 0.78 MEN1 (0.56) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL14951021 0.76 MEN1 (0.70) MEN1KMT2AMAPTKDM4EMAPK1
SCHEMBL4223927 0.76 KDM4E (0.75) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL9362200 0.76 HDAC1 (0.68) MEN1KMT2AMAPTKDM4ESMN1; SMN2
SCHEMBL14620404 0.75 MAPT (0.65) MEN1KMT2AMAPTLMNAKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7157205-B2 Intermediate layer composition for multilayer resist process, pattern-forming process using the same, and laminate FUJI PHOTO FILM CO., LTD. (JP) 2007-01-02 — — US disclosed
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