SCHEMBL14675478

SCHEMBL14675478

CCC(C)(CCN)[Si](OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7625619 0.80 TSHR (0.38)
SCHEMBL28181720 0.74
SCHEMBL3796869 0.73
SCHEMBL11584903 0.73
SCHEMBL7622006 0.70
SCHEMBL5173133 0.70
SCHEMBL5053486 0.70
SCHEMBL16128269 0.70 ALDH1A1 (0.31)
Hydrochloric Acid SCHEMBL28093138 0.69
SCHEMBL4292604 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3743452-A1 THIOL-ENE-CURING COMPOSITIONS Momentive Performance Materials GmbH (DE) 2020-12-02 EP disclosed
WO-2019145273-A1 THIOL-ENE-CURING COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS GMBH (DE) 2019-08-01 WO disclosed
EP-2739683-A2 SIZING COMPOSITION FOR CHARGES USED IN THERMOPLASTIC POLYMERIC MATERIAL REINFORCEMENT, REINFORCED POLYMERIC MATERIALS AND METHOD OF MANUFACTURE 3B-Fibreglass SPRL (BE) 2014-06-11 EP disclosed
WO-2013017471-A2 SIZING COMPOSITION FOR CHARGES USED IN THERMOPLASTIC POLYMERIC MATERIAL REINFORCEMENT, REINFORCED POLYMERIC MATERIALS AND METHOD OF MANUFACTURE 3B-FIBREGLASS SPRL (BE) 2013-02-07 WO disclosed