Sulfamate

Sulfamate

SCHEMBL146813

NS(=O)(=O)O.[Co]

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfamate SCHEMBL28281011 1.00
Sulfamate SCHEMBL30706472 1.00 CA1 (0.89)
Sulfamate SCHEMBL29042393 0.95
Sulfamate SCHEMBL4632671 0.95
Sulfamate SCHEMBL28985476 0.95 CA1 (0.80)
Sulfamate SCHEMBL11400 0.94
Sulfamate SCHEMBL2545884 0.94 CA1 (1.00)
Sulfamate SCHEMBL285371 0.94
Sulfamate SCHEMBL23498394 0.89
Sulfamate SCHEMBL20874504 0.89

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 856 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260146356-A1 RHENIUM-COBALT ALLOY COMPOSITION AND PROCESS FOR EFFECTIVE METAL ELECTRODEPOSITION IN 3D-INTEGRATION MACDERMID ENTHONE INC. (US) 2026-05-28 US claimed
CN-122082058-A Five-layer electrodeposited high-tightness corrugated pipe based on ultrasonic assistance and preparation method thereof 2026-05-26 CN claimed
CN-120158167-A Preparation method of efficient weather-resistant metal anti-corrosion coating 辽宁中舟得水环保科技有限公司 2025-06-17 CN claimed
CN-120138738-A Electronic plating cobalt additive composition for hole filling and application thereof 厦门大学 2025-06-13 CN claimed
CN-112226797-B Electroplating device and electroplating method for crystallizer copper plate 北京首钢机电有限公司 2025-05-30 CN claimed
US-20250163599-A1 SYSTEM AND METHOD FOR ELECTROFORMED COATING ON A COMPONENT GENERAL ELECTRIC COMPANY 2025-05-22 US claimed
CN-120006358-A System and method for electroforming a coating on a component 通用电气公司 2025-05-16 CN claimed
CN-119346854-A High-strength high-liquid-carrying superfine tungsten-based material electroplating diamond wire and preparation method thereof 四川锦尚新材料有限公司 2025-01-24 CN claimed
CN-115055861-B Alloy formula for wave soldering and manufacturing method thereof 深圳市兴鸿泰锡业有限公司 2024-12-13 CN claimed
CN-118957555-A Reverse displacement deposition solution based on eutectic solvent and application thereof in preparing metal activation layer by copper surface reverse displacement 杭州和韵科技有限公司 2024-11-15 CN claimed
CN-1586859-A Manufacturing method of composite material mold for resin transfer molding process BEIJING GLASS FIBER REINFORCED (CN) 2005-03-02 CN claimed
US-6755958-B2 FOR A COPPER ALLOY SURFACE; ELECTROPLATED BARRIER LAYER CONSISTING OF COBALT, COBALT-NICKEL ALLOYS, COBALT-TUNGSTEN ALLOYS, COBALT-NICKEL-TUNGSTEN ALLOYS, OR RHODIUM. HANDY & HARMAN 2004-06-29 US claimed
CN-1500916-A Gradient composite deposite for continuous casting crystallizer copper plate and production method thereof 宝山钢铁股份有限公司 2004-06-02 CN claimed
US-20030035977-A1 Barrier layer for electrical connectors and methods of applying the layer HANDY & HARMAN ELECTRONIC MATERIALS CORPORATION 2003-02-20 US claimed
WO-2002049077-A2 BARRIER LAYER FOR ELECTRICAL CONNECTORS AND METHODS OF APPLYING THE LAYER HANDY & HARMAN (US) 2002-06-20 WO claimed
US-4183789-A PRECIPITATION OF CALCIUM OXALATE M&T CHEMICALS INC. (US) 1980-01-15 US claimed
US-4101388-A RARE EARTH COMPOUNDS M & T CHEMICALS INC. (US) 1978-07-18 US claimed
US-4029556-A ELECTRODEPOSITION OF ALLOY MONACO EMLEE 1977-06-14 US claimed
US-4016051-A ELECTRODEPOSITION SOLUTION CONTAINING DIETHYLAMINOPROPYNE SULFATE STARLITE CHEMICALS, INC. (US) 1977-04-05 US claimed
US-4014759-A ASCORBIC, ISOASCORBIC OR ERYTHORBIC ACID, REACTION PRODUCT OF AROMATIC SULFINATE AND ALDEHYDE M & T CHEMICALS INC. (US) 1977-03-29 US claimed