Sulfamate

Sulfamate

SCHEMBL4632671

NS(=O)(=O)O.[Co].[Ni]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfamate SCHEMBL28281011 0.95
Sulfamate SCHEMBL30706472 0.95 CA1 (0.89)
Sulfamate SCHEMBL42731 0.95
Sulfamate SCHEMBL146813 0.95
Sulfamate SCHEMBL5147247 0.95
Sulfamate SCHEMBL29042393 0.90
Sulfamate SCHEMBL15843606 0.90
Sulfamate SCHEMBL432801 0.90 CA1 (0.80)
Sulfamate SCHEMBL11895110 0.90
Sulfamate SCHEMBL28985476 0.90 CA1 (0.80)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1924413-A2 METHOD AND APPARATUS FOR AND TO MAKE HAIR REMOVAL ELEMENTS Eveready Battery Company, Inc. (US) 2008-05-28 EP disclosed
CN-100374625-C Method for producing a cast sleeve by electroforming SHERUKOGYO KABUSHIKI KAISHA (JP) 2008-03-12 CN disclosed
WO-2007033299-A2 METHOD AND APPARATUS FOR AND TO MAKE HAIR REMOVAL ELEMENTS EVEREADY BATTERY COMPANY, INC. (US) 2007-03-22 WO disclosed
US-20070056404-A1 Method and apparatus for and to make hair removal elements 10X TECHNOLOGY LLC 2007-03-15 US disclosed
CN-1796609-A Technique for plating alnico in copper plate type of crystallizer of conticaster HUATONG CHEMICAL CO LTD XIANGF (CN) 2006-07-05 CN disclosed
CN-1623011-A Gate bush producing method by electroforming SHERUKOGYO KABUSHIKI KAISHA (JP) 2005-06-01 CN disclosed
US-6685817-B1 Method and apparatus for controlling plating over a face of a substrate FORMFACTOR, INC. 2004-02-03 US disclosed
US-6090261-A DIRECTING THE PLATING SOLUTION TO FLOW OVER A FIRST REGION OF THE FIRST FACE OF THE SUBSTRATE AND WHERE THE PLATING SOLUTION FLOWS OVER A SECOND REGION OF THE FIRST FACE IN A DIFFERENT DIRECTION; UNIFORMITY SEMICONDUCTOR WAFERS FORMFACTOR, INC. (US) 2000-07-18 US disclosed
US-6042712-A Apparatus for controlling plating over a face of a substrate FORMFACTOR, INC. (US) 2000-03-28 US disclosed