SCHEMBL1468299

SCHEMBL1468299

C=CCN(CCC)[Si](OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9357217 0.82
SCHEMBL10890784 0.82 TDP1 (0.31)
SCHEMBL8998231 0.76 TSHR (0.32)
SCHEMBL16389750 0.75
SCHEMBL231393 0.70
Bromide SCHEMBL3626984 0.70 DNM1 (0.31)
SCHEMBL22393133 0.70
Hydrochloric Acid SCHEMBL3624938 0.70 DNM1 (0.31)
SCHEMBL2380598 0.67
SCHEMBL1142675 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 187 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024203752-A1 REINFORCING FILM, OPTICAL MEMBER, AND ELECTRONIC MEMBER 日東電工株式会社 2024-10-03 WO disclosed
US-11844847-B2 Sulfur-containing polymerizable monomer and use thereof SUN MEDICAL CO., LTD. (JP) 2023-12-19 US disclosed
CN-116917368-A Curable resin composition and use thereof 株式会社钟化 2023-10-20 CN disclosed
CN-109749639-B Thermally conductive adhesive sheet 日东电工株式会社 2023-01-03 CN disclosed
WO-2022259872-A1 POLYMER PARTICLES AND METHOD FOR PRODUCING SAME 綜研化学株式会社 2022-12-15 WO disclosed
CN-110003806-B Reinforced film 日东电工株式会社 2022-10-25 CN disclosed
WO-2022202173-A1 CURABLE RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2022-09-29 WO disclosed
CN-113166600-B Adhesive sheet 日东电工株式会社 2022-08-16 CN disclosed
CN-110172309-B Adhesive sheet 日东电工株式会社 2022-08-16 CN disclosed
CN-114907787-A Adhesive sheet and optical member 日东电工株式会社 2022-08-16 CN disclosed
EP-0409411-A2 Magnetic recording medium with cured surface coating MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1991-01-23 EP disclosed
EP-0100938-B1 TREATMENT OF IMAGE-FORMING LAMINATED PLATE TORAY INDUSTRIES, INC. (JP) 1990-06-13 EP disclosed
US-4863831-A Photosensitive lithographic plate requiring no dampening water having a gelatin primer layer FUJI PHOTO FILM CO., LTD. (JP) 1989-09-05 US disclosed
US-4861698-A HARDENED GELATIN, SILICONE RUBBER FUJI PHOTO FILM CO., LTD. (JP) 1989-08-29 US disclosed
EP-0320594-A2 Aqeous crosslinkable resin dispersions, method of their production and use thereof NIPPON SHOKUBAI CO., LTD. (JP) 1989-06-21 EP disclosed
US-4769308-A Dry presensitized plate with photosensitive layer containing organotin FUJI PHOTO FILM CO., LTD. (JP) 1988-09-06 US disclosed
US-4703074-A ENCAPSULATION ELECTRICAL DEVICES DAINIPPON INK AND CHEMICALS, INC. (JP) 1987-10-27 US disclosed
US-4529659-A Magnetic recording member and process for manufacturing the same NIPPON TELEGRAPH & TELEPHONE PUBLIC CORPORATION (JP) 1985-07-16 US disclosed
US-4496647-A Treatment of image-forming laminated plate TORAY INDUSTRIES, INC. (JP) 1985-01-29 US disclosed
EP-0100938-A2 Treatment of image-forming laminated plate TORAY INDUSTRIES, INC. (JP) 1984-02-22 EP disclosed