⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11214840 | 0.71 | — | — | |
| SCHEMBL15203326 | 0.70 | — | — | |
| SCHEMBL16938282 | 0.67 | — | — | |
| SCHEMBL7059886 | 0.65 | — | — | |
| SCHEMBL5182585 | 0.64 | — | — | |
| SCHEMBL27649160 | 0.64 | — | — | |
| SCHEMBL18098779 | 0.62 | — | — | |
| SCHEMBL1470038 | 0.62 | — | — | |
| SCHEMBL17898110 | 0.62 | — | — | |
| SCHEMBL16784555 | 0.60 | ALDH1A1 (0.35) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 86 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109721734-B | Double-end alkoxy silicone resin and preparation method thereof | 上海东大化学有限公司 | 2021-08-03 | — | — | CN | claimed |
| EP-4656377-A1 | LAMINATED BODY, METHOD FOR MANUFACTURING LAMINATED BODY, METHOD FOR MANUFACTURING ELEMENT, IMAGING DEVICE, METHOD FOR MANUFACTURING IMAGING DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Sekisui Chemical Co., Ltd. (JP) | 2025-12-03 | — | — | EP | disclosed |
| WO-2025063069-A1 | CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYER OBJECT, AND SEMICONDUCTOR DEVICE | 積水化学工業株式会社 | 2025-03-27 | — | — | WO | disclosed |
| US-20250054895-A1 | CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING MULTILAYERED OBJECT, AND METHOD FOR PRODUCING ELEMENT HAVING JUNCTION ELECTRODE | SEKISUI CHEMICAL CO., LTD. (JP) | 2025-02-13 | — | — | US | disclosed |
| US-20250051573-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, IMAGING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING ELEMENT HAVING CONTACT ELECTRODE | SEKISUI CHEMICAL CO., LTD (JP) | 2025-02-13 | — | — | US | disclosed |
| WO-2025009514-A1 | CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYER OBJECT, IMAGING DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING MULTILAYER OBJECT | 積水化学工業株式会社 | 2025-01-09 | — | — | WO | disclosed |
| EP-4455224-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, IMAGING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING ELEMENT HAVING CONTACT ELECTRODE | SEKISUI CHEMICAL CO., LTD. (JP) | 2024-10-30 | — | — | EP | disclosed |
| EP-4455223-A1 | CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING MULTILAYERED OBJECT, AND METHOD FOR PRODUCING ELEMENT HAVING JUNCTION ELECTRODE | SEKISUI CHEMICAL CO., LTD. (JP) | 2024-10-30 | — | — | EP | disclosed |
| WO-2024157914-A1 | LAMINATED BODY, METHOD FOR MANUFACTURING LAMINATED BODY, METHOD FOR MANUFACTURING ELEMENT, IMAGING DEVICE, METHOD FOR MANUFACTURING IMAGING DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 積水化学工業株式会社 | 2024-08-02 | — | — | WO | disclosed |
| WO-2023120627-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, IMAGING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING ELEMENT HAVING CONTACT ELECTRODE | 積水化学工業株式会社 | 2023-06-29 | — | — | WO | disclosed |
| US-6534615-B2 | Reacting polydimethylsiloxane, polymethylvinylsiloxane and polymethyltrifluoropropylsiloxane with N-((3-aminopropyl)di-methylsilyl)-2,2-dimethyl-1-aza-2-silacyclopentane | CONSORTIUM FUR ELEKTROCHEMISCHE INDUSTRIE GMBH (DE) | 2003-03-18 | — | — | US | disclosed |
| WO-2003014194-A1 | ORGANOPOLYSILOXANE / POLYUREA / POLYURETHANE BLOCK COPOLYMERS | Consortium für elektrochemische Industrie GmbH (DE) | 2003-02-20 | — | — | WO | disclosed |
| WO-2003008485-A1 | RTV-1-SILICONE-RUBBER BLENDS WHICH CROSS-LINK BY MEANS OF ALKOXY GROUPS | Consortium für elektrochemische Industrie GmbH (DE) | 2003-01-30 | — | — | WO | disclosed |
| US-20020140076-A1 | Multi-layer wiring circuit board and method for producing the same | NITTO DENKO CORPORATION | 2002-10-03 | — | — | US | disclosed |
| US-20020108781-A1 | Printed wiring board and production thereof | NITTO DENKO CORPORATION | 2002-08-15 | — | — | US | disclosed |
| EP-1201699-A1 | Process for preparing aminofunctional siloxanes | Consortium für elektrochemische Industrie GmbH (DE) | 2002-05-02 | — | — | EP | disclosed |
| US-20020049296-A1 | Preparation of amino-functional siloxanes | CONSORTIUM FUR ELEKTROCHEMISCHE INDUSTRIE GMBH (DE) | 2002-04-25 | — | — | US | disclosed |
| US-6300037-B1 | POLYIMIDE PRECURSOR FORMS PATTERNED FILM BY EXPOSURE TO LIGHT THROUGH PHOTOMASK; DEVELOPMENT; FILM MELTS UPON HEATING; BONDING STRENGTH | NITTO DENKO CORPORATION (JP) | 2001-10-09 | — | — | US | disclosed |
| US-6040115-A | THERMALLY IMAGING A THERMOSENSITIVE ELEMENT SUBSTRATE COATED WITH INK REPELLENT POLYMER COMPRISING SILICONE SEGMENTS AND HARD SEGMENTS TO FORM LITHOGRAPHIC PRINTING PLATE DEVELOPABLE WITHOUT WIPING | KODAK POLYCHROME GRAPHICS LLC (US) | 2000-03-21 | — | — | US | disclosed |
| US-5536970-A | NONCRACKING, RELIABILITY, MOISTURE RESISTANCE | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-07-16 | — | — | US | disclosed |