SCHEMBL1470193

SCHEMBL1470193

Oc1c(Cl)cccc1/N=N/c1ccc2ccccc2c1O

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 5/20 0.58
L3MBTL1 Q9Y468 4/20 0.58
MEN1 O00255 4/20 0.58
NPC1 O15118 4/20 0.58
RAB9A P51151 3/20 0.58
KDM4E B2RXH2 3/20 0.55
MAPT P10636 3/20 0.55
LMNA P02545 2/20 0.55
HTT P42858 2/20 0.55
PKM P14618 1/20 0.55
OPRK1 P41145 1/20 0.55
SMN1; SMN2 Q16637 1/20 0.55
NPSR1 Q6W5P4 1/20 0.55
TDP1 Q9NUW8 1/20 0.55
CTRB1 P17538 1/20 0.52
PABPC1 P11940 1/20 0.52
IDO1 P14902 1/20 0.52
TDO2 P48775 1/20 0.52
CYP1A2 P05177 2/20 0.47
CYP2A6 P11509 2/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8971645 0.86 L3MBTL1 (0.65) KMT2AL3MBTL1MEN1NPC1RAB9A
SCHEMBL8971639 0.86 L3MBTL1 (0.65) KMT2AL3MBTL1MEN1NPC1RAB9A
SCHEMBL387565 0.86 KMT2A (0.73) KMT2AL3MBTL1MEN1NPC1RAB9A
SCHEMBL10781209 0.84 L3MBTL1 (0.63) KMT2AL3MBTL1MEN1NPC1RAB9A
SCHEMBL6550519 0.81 KMT2A (0.63) KMT2AL3MBTL1MEN1NPC1RAB9A
SCHEMBL6550515 0.81 KMT2A (0.63) KMT2AL3MBTL1MEN1NPC1RAB9A
SCHEMBL8660991 0.79 KMT2A (0.61) KMT2AL3MBTL1MEN1NPC1RAB9A
SCHEMBL5968204 0.78 L3MBTL1 (0.59) KMT2AL3MBTL1MEN1NPC1RAB9A
SCHEMBL9634088 0.78 KMT2A (0.73) KMT2AL3MBTL1MEN1NPC1RAB9A
SCHEMBL5968201 0.78 L3MBTL1 (0.59) KMT2AL3MBTL1MEN1NPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8294282-B2 Semiconductor device and adhesive sheet KABUSHIKI KAISHA TOSHIBA (JP) 2012-10-23 US disclosed
US-20110068480-A1 SEMICONDUCTOR DEVICE AND ADHESIVE SHEET TOSHIBA MEMORY CORPORATION (JP) 2011-03-24 US disclosed
EP-1146062-B1 Method of producing crosslinkable silyl group-containing polyoxyalkylene polymers KANEKA CORP (JP) 2006-12-20 EP disclosed
US-6503995-B2 Hydrosilation KANEKA CORPORATION (JP) 2003-01-07 US disclosed
US-6498132-B2 SURFACE TREATMENT COMPOSITION COMPRISES A COMPLEXING AGENT AS A METAL DEPOSITION PREVENTIVE COMPRISING ATLEAST ONE AROMATIC HYDROCARBON RING CONTAINING HYDROXY OR O-GROUP DIRECTLY ATTACHED WITH RING CARBON AND A SECOND COMPLEXING AGENT MITSUBISHI CHEMICAL CORPORATION (JP) 2002-12-24 US disclosed
US-20020045556-A1 Method for treating surface of substrate and surface treatment composition used for the same MITSUBISHI CHEMICAL CORPORATION (JP) 2002-04-18 US disclosed
US-20020013427-A1 Method of producing crosslinkable silyl group-containing polyoxyalkylene polymers KANEKA CORPORATION (JP) 2002-01-31 US disclosed
EP-1146062-A1 Method of producing crosslinkable silyl group-containing polyoxyalkylene polymers Kaneka Corporation (JP) 2001-10-17 EP disclosed
US-5885362-A APPLYING TO SURFACE A COMPOSITION COMPRISING A LIQUID MEDIUM AND AT LEAST ONE COMPLEXING AGENT, FOR EXAMPLE ETHYLENEDIAMINEDIORTHOHYDROXYPHENYLACETIC ACID MITSUBISHI CHEMICAL CORPORATION (JP) 1999-03-23 US disclosed
US-5790627-A Method and apparatus for observing a specimen using an X-ray microscope RESEARCH DEVELOPMENT CORP. (JP) 1998-08-04 US disclosed
EP-0789071-A1 METHOD FOR TREATING SURFACE OF SUBSTRATE AND SURFACE TREATMENT COMPOSITION THEREFOR MITSUBISHI CHEMICAL CORPORATION (JP) 1997-08-13 EP disclosed