⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1470017 | 0.98 | — | — | |
| SCHEMBL2208581 | 0.90 | — | — | |
| SCHEMBL207819 | 0.85 | — | — | |
| SCHEMBL5145776 | 0.83 | — | — | |
| SCHEMBL28448445 | 0.83 | — | — | |
| SCHEMBL232074 | 0.83 | — | — | |
| SCHEMBL1472195 | 0.82 | — | — | |
| SCHEMBL1470743 | 0.81 | — | — | |
| SCHEMBL1470762 | 0.81 | — | — | |
| Alcohol SCHEMBL28850434 | 0.81 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119371666-A | Method for producing solvent-free silicone composition | 阪田油墨株式会社 | 2025-01-28 | — | — | CN | disclosed |
| CN-119371667-A | Solvent-free silicone composition and method for producing silicone compound | 阪田油墨株式会社 | 2025-01-28 | — | — | CN | disclosed |
| CN-115491904-A | Durable antibacterial garment | 福建省尚飞制衣有限公司 | 2022-12-20 | — | — | CN | disclosed |
| US-10790461-B2 | Field-effect transistor, method for manufacturing the same, and wireless communication device and goods tag including the same | TORAY INDUSTRIES, INC. (JP) | 2020-09-29 | — | — | US | disclosed |
| EP-3547383-B1 | FIELD EFFECT TRANSISTOR, METHOD FOR PRODUCING SAME, WIRELESS COMMUNICATION DEVICE USING SAME AND ARTICLE TAG | TORAY INDUSTRIES (JP) | 2020-06-24 | — | — | EP | disclosed |
| US-10490748-B2 | Rectifying element, method for producing same, and wireless communication device | TORAY INDUSTRIES, INC. (JP) | 2019-11-26 | — | — | US | disclosed |
| EP-3547383-A1 | FIELD EFFECT TRANSISTOR, METHOD FOR PRODUCING SAME, WIRELESS COMMUNICATION DEVICE USING SAME AND ARTICLE TAG | Toray Industries, Inc. (JP) | 2019-10-02 | — | — | EP | disclosed |
| US-20180026197-A1 | RECTIFYING ELEMENT, METHOD FOR PRODUCING SAME, AND WIRELESS COMMUNICATION DEVICE | TORAY INDUSTRIES, INC. (JP) | 2018-01-25 | — | — | US | disclosed |
| US-20160035457-A1 | FIELD EFFECT TRANSISTOR | TORAY INDUSTRIES, INC. (JP) | 2016-02-04 | — | — | US | disclosed |
| EP-2975649-A1 | FIELD EFFECT TRANSISTOR | Toray Industries, Inc. (JP) | 2016-01-20 | — | — | EP | disclosed |
| EP-2259289-A1 | GATE INSULATING MATERIAL, GATE INSULATING FILM, AND ORGANIC FIELD EFFECT TRANSISTOR | Toray Industries, Inc. (JP) | 2010-12-08 | — | — | EP | disclosed |
| US-7837459-B2 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-11-23 | — | — | US | disclosed |
| US-20090023083-A1 | fabrication of dual damascene structures using imprint lithographic techniques; fabrication of dual damascene relief structures in imprint lithography molds | GLOBALFOUNDRIES U.S. INC. | 2009-01-22 | — | — | US | disclosed |
| US-20080305197-A1 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning | GLOBALFOUNDRIES U.S. INC. | 2008-12-11 | — | — | US | disclosed |
| US-20080303160-A1 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning | GLOBALFOUNDRIES U.S. INC. | 2008-12-11 | — | — | US | disclosed |
| US-7435074-B2 | Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-10-14 | — | — | US | disclosed |
| US-20050202350-A1 | Multilevel mold; used for the interconnect architecture of semiconductor chips | GLOBALFOUNDRIES U.S. INC. | 2005-09-15 | — | — | US | disclosed |
| US-6852368-B2 | Hard coating composition and resin product with hard coat | NIPPON ARC CO., LTD. (JP) | 2005-02-08 | — | — | US | disclosed |
| US-20030194571-A1 | Hard coating composition and resin product with hard coat | NIPPON ARC CO., LTD. (JP) | 2003-10-16 | — | — | US | disclosed |
| EP-1298177-A1 | HARD COATING COMPOSITION AND RESIN PRODUCT WITH HARD COAT | NIPPON ARC CO., LTD. (JP) | 2003-04-02 | — | — | EP | disclosed |