⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1470693 | 0.90 | — | — | |
| SCHEMBL1470017 | 0.88 | — | — | |
| SCHEMBL157272 | 0.84 | — | — | |
| SCHEMBL29264647 | 0.79 | — | — | |
| SCHEMBL3741756 | 0.77 | — | — | |
| SCHEMBL740764 | 0.77 | — | — | |
| SCHEMBL207819 | 0.74 | — | — | |
| SCHEMBL232074 | 0.72 | — | — | |
| SCHEMBL28448445 | 0.72 | — | — | |
| SCHEMBL5145776 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116130188-B | AC lightning arrester | 醴陵市东方电瓷电器有限公司 | 2024-12-31 | — | — | CN | disclosed |
| CN-116130188-A | AC lightning arrester | 醴陵市东方电瓷电器有限公司 | 2023-05-16 | — | — | CN | disclosed |
| US-7982312-B2 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-07-19 | — | — | US | disclosed |
| US-7862989-B2 | fabrication of dual damascene structures using imprint lithographic techniques; fabrication of dual damascene relief structures in imprint lithography molds | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-01-04 | — | — | US | disclosed |
| US-7837459-B2 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-11-23 | — | — | US | disclosed |
| US-20090023083-A1 | fabrication of dual damascene structures using imprint lithographic techniques; fabrication of dual damascene relief structures in imprint lithography molds | GLOBALFOUNDRIES U.S. INC. | 2009-01-22 | — | — | US | disclosed |
| US-20080303160-A1 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning | GLOBALFOUNDRIES U.S. INC. | 2008-12-11 | — | — | US | disclosed |
| US-20080305197-A1 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning | GLOBALFOUNDRIES U.S. INC. | 2008-12-11 | — | — | US | disclosed |
| US-7435074-B2 | Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-10-14 | — | — | US | disclosed |
| US-20050202350-A1 | Multilevel mold; used for the interconnect architecture of semiconductor chips | GLOBALFOUNDRIES U.S. INC. | 2005-09-15 | — | — | US | disclosed |