Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES2 | O00748 | 1/20 | 0.44 |
| ▸ | GPR84 | Q9NQS5 | 7/20 | 0.43 |
| ▸ | PPARG | P37231 | 7/20 | 0.43 |
| ▸ | PPARD | Q03181 | 7/20 | 0.43 |
| ▸ | PPARA | Q07869 | 7/20 | 0.43 |
| ▸ | HDAC11 | Q96DB2 | 5/20 | 0.43 |
| ▸ | TSHR | P16473 | 4/20 | 0.43 |
| ▸ | PTPN1 | P18031 | 3/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.43 |
| ▸ | TLR2 | O60603 | 2/20 | 0.43 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.43 |
| ▸ | FABP4 | P15090 | 2/20 | 0.43 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.43 |
| ▸ | SLC22A8 | Q8TCC7 | 1/20 | 0.43 |
| ▸ | MEN1 | O00255 | 1/20 | 0.43 |
| ▸ | ESR1 | P03372 | 1/20 | 0.43 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.43 |
| ▸ | PDE4A | P27815 | 1/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.43 |
| ▸ | PDE3A | Q14432 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28023558 | 1.00 | CES2 (0.44) | CES2GPR84PPARGPPARDPPARA | |
| SCHEMBL14715848 | 1.00 | CES2 (0.44) | CES2GPR84PPARGPPARDPPARA | |
| SCHEMBL16970368 | 1.00 | CES2 (0.44) | CES2GPR84PPARGPPARDPPARA | |
| SCHEMBL7938320 | 1.00 | CES2 (0.44) | CES2GPR84PPARGPPARDPPARA | |
| SCHEMBL10674027 | 1.00 | CES2 (0.44) | CES2GPR84PPARGPPARDPPARA | |
| SCHEMBL2142785 | 1.00 | CES2 (0.44) | CES2GPR84PPARGPPARDPPARA | |
| SCHEMBL513791 | 1.00 | CES2 (0.44) | CES2GPR84PPARGPPARDPPARA | |
| SCHEMBL14716164 | 1.00 | CES2 (0.44) | CES2GPR84PPARGPPARDPPARA | |
| SCHEMBL429641 | 1.00 | CES2 (0.44) | CES2GPR84PPARGPPARDPPARA | |
| SCHEMBL16969592 | 1.00 | CES2 (0.44) | CES2GPR84PPARGPPARDPPARA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116601195-A | Internally emulsified polyurethane dispersion and method for producing the same | 陶氏环球技术有限责任公司 | 2023-08-15 | — | — | CN | claimed |
| CN-113143827-A | Anti-aging and anti-wrinkling face cream and preparation method thereof | 陈鉴武 | 2021-07-23 | — | — | CN | claimed |
| CN-116601195-A | Internally emulsified polyurethane dispersion and method for producing the same | 陶氏环球技术有限责任公司 | 2023-08-15 | — | — | CN | disclosed |
| EP-3412796-B1 | FILM MATERIAL AND COLD SPRAY METHOD | TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP) | 2021-09-15 | — | — | EP | disclosed |
| CN-113143827-A | Anti-aging and anti-wrinkling face cream and preparation method thereof | 陈鉴武 | 2021-07-23 | — | — | CN | disclosed |
| US-20180355487-A1 | FILM MATERIAL AND COLD SPRAY METHOD | TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) | 2018-12-13 | — | — | US | disclosed |
| EP-3412796-A1 | FILM MATERIAL AND COLD SPRAY METHOD | Tatsuta Electric Wire & Cable Co., Ltd. (JP) | 2018-12-12 | — | — | EP | disclosed |
| EP-2565245-B1 | Moisture-proof material | NITTO DENKO CORP (JP) | 2018-07-25 | — | — | EP | disclosed |
| CN-104816104-B | Ag balls, Ag cores ball, scaling powder coating Ag balls, scaling powder coating Ag cores ball, solder joints, forming solder, soldering paste | 千住金属工业株式会社 | 2018-07-03 | — | — | CN | disclosed |
| EP-2905349-B1 | Ag ball, solder joint, formed solder, solder paste and silver paste | SENJU METAL INDUSTRY CO (JP) | 2017-05-17 | — | — | EP | disclosed |
| CN-103421442-B | Moisture-proof material | 日东电工株式会社 | 2017-04-19 | — | — | CN | disclosed |
| US-9266196-B2 | Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2016-02-23 | — | — | US | disclosed |
| EP-2905349-A2 | Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2015-08-12 | — | — | EP | disclosed |
| US-20150217409-A1 | Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE | Senju Metal lndustry Co., Ltd. (JP) | 2015-08-06 | — | — | US | disclosed |
| CN-104816104-A | Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste | SENJU METAL INDUSTRY CO | 2015-08-05 | — | — | CN | disclosed |
| US-20130337261-A1 | MOISTURE-PROOF MATERIAL | NITTO DENKO CORPORATION (JP) | 2013-12-19 | — | — | US | disclosed |
| CN-103421442-A | Moisture-proof material | NITTO DENKO CORP | 2013-12-04 | — | — | CN | disclosed |
| EP-2666836-A2 | Moisture-proof material | Nitto Denko Corporation (JP) | 2013-11-27 | — | — | EP | disclosed |
| EP-2565245-A2 | Moisture-proof material | NITTO DENKO CORPORATION (JP) | 2013-03-06 | — | — | EP | disclosed |
| US-20130052461-A1 | MOISTURE-PROOF MATERIAL | NITTO DENKO CORPORATION (JP) | 2013-02-28 | — | — | US | disclosed |