SCHEMBL1472153

SCHEMBL1472153

O=C(O)C1CC2CC(C1)C(=O)OC2=O

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKR1C3 P42330 1/20 0.38
AKR1C1 Q04828 1/20 0.38
CYP2C19 P33261 2/20 0.32
GABRR1 P24046 1/20 0.32
OAT P04181 1/20 0.32
CYP1A2 P05177 1/20 0.31
CYP2D6 P10635 1/20 0.31
ALOX15 P16050 1/20 0.31
SLC1A3 P43003 1/20 0.31
SLC1A2 P43004 1/20 0.31
SLC1A1 P43005 1/20 0.31
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
ABAT P80404 1/20 0.31
MAPT P10636 1/20 0.31
APLNR P35414 1/20 0.30
GABRP O00591 1/20 0.30
GABRD O14764 1/20 0.30
GABRA1 P14867 1/20 0.30
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL5856466 0.98 AKR1C3 (0.37) AKR1C3AKR1C1CYP2C19GABRR1OAT
SCHEMBL5856453 0.82
SCHEMBL18903326 0.80 KDM4E (0.39) CYP2D6TSHRPMP22
SCHEMBL11853951 0.80
SCHEMBL18873151 0.79 AKR1C3 (0.39) AKR1C3AKR1C1ALOX15
SCHEMBL2132460 0.79 CYP2C19 (0.33) AKR1C3AKR1C1CYP2C19GABRR1OAT
SCHEMBL787035 0.77 AKR1C3 (0.35) AKR1C3AKR1C1
SCHEMBL17207722 0.73 AKR1C3 (0.38) AKR1C3AKR1C1CYP2C19GABRR1CYP1A2
SCHEMBL2476729 0.72 GABRR1 (0.33) GABRR1TSHR
SCHEMBL15945912 0.72 KDM4E (0.35) CYP2D6PMP22

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7098258-B2 Heat-curable resin composition and use thereof MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2006-08-29 US claimed
EP-1493766-B1 Heat-curable resin composition and use thereof MITSUBISHI GAS CHEMICAL CO (JP) 2006-06-07 EP claimed
EP-1493766-A1 Heat-curable resin composition and use thereof MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2005-01-05 EP claimed
US-20040266980-A1 Heat-curable resin composition and use thereof MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2004-12-30 US claimed
EP-1149836-B1 Polynalbuphine derivatives HU OLIVER YOA PU (TW) 2003-02-26 EP claimed
EP-1149836-A1 Polynalbuphine derivatives Hu, Oliver Yoa-Pu (TW) 2001-10-31 EP claimed
US-12351686-B2 Curable resin composition, dry film and cured product of same, and electronic component containing said cured product TAIYO HOLDINGS CO., LTD. (JP) 2025-07-08 US disclosed
CN-119948406-A Photosensitive colored resin composition, cured product, partition wall, organic electroluminescent element, color filter, and image display device 三菱化学株式会社 2025-05-06 CN disclosed
US-12291604-B2 Curable resin composition, dry film and cured product thereof, and electronic component including cured product TAIYO HOLDINGS CO., LTD. (JP) 2025-05-06 US disclosed
WO-2025075166-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PARTITION WALL, ORGANIC ELECTROLUMINESCENT ELEMENT, AND IMAGE DISPLAY DEVICE 三菱ケミカル株式会社 2025-04-10 WO disclosed
CN-114269857-B Curable resin composition, dry film and cured product thereof, and electronic component comprising the cured product 太阳控股株式会社 2025-02-25 CN disclosed
WO-2024122565-A1 PHOTOSENSITIVE COLORED RESIN COMPOSITION, CURED PRODUCT, PARTITION WALL, ORGANIC ELECTROLUMINESCENT ELEMENT, COLOR FILTER, AND IMAGE DISPLAY DEVICE 三菱ケミカル株式会社 2024-06-13 WO disclosed
CN-113544184-B Composition for film formation, cured film, liquid crystal alignment film, and retardation film JSR株式会社 2024-05-14 CN disclosed
EP-2182406-A1 LIQUID CRYSTAL ALIGNING AGENT, METHOD FOR FORMING LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY DEVICE JSR Corporation (JP) 2010-05-05 EP disclosed
US-7098258-B2 Heat-curable resin composition and use thereof MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2006-08-29 US disclosed
EP-1493766-B1 Heat-curable resin composition and use thereof MITSUBISHI GAS CHEMICAL CO (JP) 2006-06-07 EP disclosed
EP-1493766-A1 Heat-curable resin composition and use thereof MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2005-01-05 EP disclosed
US-20040266980-A1 Heat-curable resin composition and use thereof MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2004-12-30 US disclosed
EP-1149836-B1 Polynalbuphine derivatives HU OLIVER YOA PU (TW) 2003-02-26 EP disclosed
EP-1149836-A1 Polynalbuphine derivatives Hu, Oliver Yoa-Pu (TW) 2001-10-31 EP disclosed