⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1475755 | 1.00 | — | — | |
| SCHEMBL4563971 | 0.86 | ALDH1A1 (0.32) | — | |
| SCHEMBL9255641 | 0.85 | SMPD1 (0.37) | — | |
| SCHEMBL9255651 | 0.85 | SMPD1 (0.37) | — | |
| SCHEMBL9255676 | 0.81 | — | — | |
| SCHEMBL6836188 | 0.80 | — | — | |
| SCHEMBL6062120 | 0.80 | — | — | |
| SCHEMBL4607862 | 0.80 | — | — | |
| SCHEMBL6062104 | 0.80 | — | — | |
| SCHEMBL9725284 | 0.79 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250197621-A1 | THERMOPLASTIC RESIN COMPOSITION | MITSUI CHEMICALS, INC. (JP) | 2025-06-19 | — | — | US | disclosed |
| EP-4495182-A1 | THERMOPLASTIC RESIN COMPOSITION | Mitsui Chemicals, Inc. (JP) | 2025-01-22 | — | — | EP | disclosed |
| CN-118871529-A | Thermoplastic resin composition | 三井化学株式会社 | 2024-10-29 | — | — | CN | disclosed |
| WO-2024204149-A1 | ADHESIVE COMPOSITION AND METHOD FOR PRODUCING SAME, AND ADHESIVE SHEET | 三井化学株式会社 | 2024-10-03 | — | — | WO | disclosed |
| WO-2023176788-A1 | THERMOPLASTIC RESIN COMPOSITION | 三井化学株式会社 | 2023-09-21 | — | — | WO | disclosed |
| EP-2660927-B1 | SEALANT COMPOSITION FOR PHOTOELECTRIC CONVERSION ELEMENT | THREEBOND FINE CHEMICAL CO LTD (JP) | 2018-08-22 | — | — | EP | disclosed |
| EP-2660927-A1 | SEALANT COMPOSITION FOR PHOTOELECTRIC CONVERSION ELEMENT | Threebond Co., Ltd. (JP) | 2013-11-06 | — | — | EP | disclosed |
| US-7915524-B2 | Sealing agent for photoelectric conversion device and photoelectric conversion device using the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2011-03-29 | — | — | US | disclosed |
| US-20060162771-A1 | Sealing agent for photoelectric conversion element and photoelectric conversion device element using the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2006-07-27 | — | — | US | disclosed |
| EP-0919595-B1 | MOLDING RESIN COMPOSITION | MITSUI CHEMICALS INC (JP) | 2006-04-26 | — | — | EP | disclosed |
| EP-1598897-A1 | SEALING AGENT FOR PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOELECTRIC CONVERSION ELEMENT USING THE SAME | Nippon Kayaku Kabushiki Kaisha (JP) | 2005-11-23 | — | — | EP | disclosed |
| US-6221961-B1 | Molding resin composition | MITSUI CHEMICALS, INC. (JP) | 2001-04-24 | — | — | US | disclosed |
| EP-0826718-B1 | Amorphous SiCO and crystalline SiC fibers form curable alk-1-enyl ether functional siloxane resins | DOW CORNING (US) | 1999-12-01 | — | — | EP | disclosed |
| EP-0919595-A1 | MOLDING RESIN COMPOSITION | Mitsui Chemicals, Inc. (JP) | 1999-06-02 | — | — | EP | disclosed |
| US-5814271-A | Process of producing fibers from curable alk-1-enyl ether functional siloxane resins | DOW CORNING CORPORATION (US) | 1998-09-29 | — | — | US | disclosed |
| EP-0826718-A2 | Amorphous SiCO and crystalline SiC fibers form curable alk-1-enyl ether functional siloxane resins | DOW CORNING CORPORATION (US) | 1998-03-04 | — | — | EP | disclosed |
| US-5373032-A | Hardness, flexible, wear and chemical resistant protective coatings | ISP INVESTMENTS INC. (US) | 1994-12-13 | — | — | US | disclosed |
| US-5094917-A | Chemical resistant coatings | ISP INVESTMENTS INC. (US) | 1992-03-10 | — | — | US | disclosed |
| US-5039716-A | Cross-linking agent; chemical resistant coatings, nontoxic | GAF CHEMICALS CORPORATION (US) | 1991-08-13 | — | — | US | disclosed |
| WO-1991011467-A1 | ALKENYL ETHERS AND RADIATION CURABLE COMPOSITIONS | ISP INVESTMENTS INC. (US) | 1991-08-08 | — | — | WO | disclosed |