SCHEMBL1475813

SCHEMBL1475813

C/C=C\OC1CCCCC1

nearest known ligand 0.31

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
ACHE P22303 1/20 0.31
CA1 P00915 2/20 0.31
CA2 P00918 2/20 0.31
ADH1C P00326 1/20 0.31
ADH1A P07327 1/20 0.31
CA12 O43570 1/20 0.30
CA9 Q16790 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1475814 1.00 ACHE (0.31) ACHECA1CA2ADH1CADH1A
SCHEMBL15227532 1.00 ACHE (0.31) ACHECA1CA2ADH1CADH1A
SCHEMBL3942982 1.00 ACHE (0.31) ACHECA1CA2ADH1CADH1A
SCHEMBL3942990 1.00 ACHE (0.31) ACHECA1CA2ADH1CADH1A
SCHEMBL4030169 1.00 ACHE (0.31) ACHECA1CA2ADH1CADH1A
SCHEMBL3943548 0.97
SCHEMBL3943541 0.97
SCHEMBL11797442 0.97
SCHEMBL3945820 0.92
SCHEMBL3945813 0.92

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-7003201-A None JP disclosed
EP-2660927-B1 SEALANT COMPOSITION FOR PHOTOELECTRIC CONVERSION ELEMENT THREEBOND FINE CHEMICAL CO LTD (JP) 2018-08-22 EP disclosed
CN-103283085-B Sealant composition for photoelectric conversion element THREE BOND CO.,LTD. (JP) 2015-12-09 CN disclosed
EP-2660927-A1 SEALANT COMPOSITION FOR PHOTOELECTRIC CONVERSION ELEMENT Threebond Co., Ltd. (JP) 2013-11-06 EP disclosed
US-20130230770-A1 NON-AQUEOUS SECONDARY BATTERY HITACHI MAXELL, LTD. (JP) 2013-09-05 US disclosed
CN-103283085-A Sealant composition for photoelectric conversion element THREE BOND CO LTD 2013-09-04 CN disclosed
CN-103262326-A Non-aqueous secondary battery HITACHI MAXELL 2013-08-21 CN disclosed
US-7915524-B2 Sealing agent for photoelectric conversion device and photoelectric conversion device using the same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2011-03-29 US disclosed
CN-100407494-C Sealing agent for photoelectric conversion element and photoelectric conversion element using the same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-07-30 CN disclosed
EP-1803701-A1 Process for the preparation of vinyl ether compounds Daicel Chemical Industries, Ltd. (JP) 2007-07-04 EP disclosed
US-7119160-B2 Polyalkenyl ether resin KYOWA HAKKO CHEMICAL CO., LTD. (JP) 2006-10-10 US disclosed
US-20060162771-A1 Sealing agent for photoelectric conversion element and photoelectric conversion device element using the same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2006-07-27 US disclosed
EP-1679349-A1 RESIN COMPOSITION Kyowa Hakko Chemical Co., Ltd. (JP) 2006-07-12 EP disclosed
CN-1751410-A Sealing agent for photoelectric conversion element and photoelectric conversion element using the same NIPPON KAYAKU KK (JP) 2006-03-22 CN disclosed
EP-1598897-A1 SEALING AGENT FOR PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOELECTRIC CONVERSION ELEMENT USING THE SAME Nippon Kayaku Kabushiki Kaisha (JP) 2005-11-23 EP disclosed
US-20050176889-A1 Polyalkenyl ether resin KYOWA HAKKO CHEMICAL CO. LTD. (JP) 2005-08-11 US disclosed
CN-1643021-A Polyalkenyl ether resin KYOWA YUKA KK (JP) 2005-07-20 CN disclosed
US-6838224-B2 Chemical amplification, positive resist compositions SHI-ETSU CHEMICAL CO., LTD. (JP) 2005-01-04 US disclosed
US-20010033994-A1 Chemical amplification, positive resist compositions SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-25 US disclosed
JP-H073201-A CURABLE RESIN COMPOSITION FOR COATING MATERIAL ASAHI GLASS CO LTD 1995-01-06 JP disclosed