Known targets — ChEMBL curated mechanism
ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA
The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL553592 | 0.82 | — | — | |
| Hydrochloric Acid SCHEMBL14691308 | 0.82 | — | — | |
| Hydrochloric Acid SCHEMBL34802 | 0.82 | — | — | |
| Water SCHEMBL545666 | 0.67 | — | — | |
| Hydrochloric Acid SCHEMBL150036 | 0.67 | — | — | |
| Methane SCHEMBL23040988 | 0.67 | — | — | |
| Water SCHEMBL994296 | 0.67 | — | — | |
| Phosphine SCHEMBL12818347 | 0.67 | — | — | |
| Hydrochloric Acid SCHEMBL18918410 | 0.67 | — | — | |
| Water SCHEMBL2197085 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9303326-B2 | Acidic gold alloy plating solution | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2016-04-05 | — | — | US | disclosed |
| US-9297087-B2 | Acidic gold alloy plating solution | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2016-03-29 | — | — | US | disclosed |
| EP-2014801-B1 | An acidic gold alloy plating solution | ROHM & HAAS ELECT MAT (US) | 2013-11-13 | — | — | EP | disclosed |
| US-8357285-B2 | Acidic gold alloy plating solution | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2013-01-22 | — | — | US | disclosed |
| US-20120055802-A1 | ACIDIC GOLD ALLOY PLATING SOLUTION | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-03-08 | — | — | US | disclosed |
| US-20120048740-A1 | ACIDIC GOLD ALLOY PLATING SOLUTION | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-03-01 | — | — | US | disclosed |
| US-20110127168-A1 | HARD GOLD-BASED PLATING SOLUTION | ELECTROPLATING ENGINEERS OF JAPAN LIMITED (JP) | 2011-06-02 | — | — | US | disclosed |
| US-20090014335-A1 | Acidic gold alloy plating solution | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2009-01-15 | — | — | US | disclosed |
| EP-2014801-A2 | An acidic gold alloy plating solution | Rohm and Haas Electronic Materials LLC (US) | 2009-01-14 | — | — | EP | disclosed |