Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ATM | Q13315 | 2/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5653718 | 0.79 | — | — | |
| SCHEMBL2374906 | 0.78 | — | — | |
| SCHEMBL57065 | 0.68 | KAT2A (0.31) | — | |
| SCHEMBL1844205 | 0.68 | — | — | |
| SCHEMBL9070262 | 0.67 | — | — | |
| SCHEMBL545349 | 0.66 | — | — | |
| SCHEMBL2382714 | 0.66 | NAAA (0.40) | ATM | |
| SCHEMBL26353243 | 0.65 | SSTR4 (0.36) | — | |
| SCHEMBL118416 | 0.65 | SSTR4 (0.36) | — | |
| SCHEMBL26353589 | 0.65 | SSTR4 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 472 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20170102347-A1 | BIOCHEMICAL TEST CHIP | APEX BIOTECHNOLOGY CORP. (TW) | 2017-04-13 | — | — | US | claimed |
| EP-3153857-A1 | BIOCHEMICAL TEST CHIP | Apex Biotechnology Corporation (TW) | 2017-04-12 | — | — | EP | claimed |
| US-8173048-B2 | Composition for circuit connection film and circuit connection film using the same | CHEIL INDUSTRIES, INC. (KR) | 2012-05-08 | — | — | US | claimed |
| US-20100148130-A1 | Composition for circuit connection film and circuit connection film using the same | KUKDO ADVANCED MATERIALS CO., LTD. (KR) | 2010-06-17 | — | — | US | claimed |
| US-6316563-B2 | FOR OBTAINING A HIGHLY ION-CONDUCTIVE SOLID POLYMER ELECTROLYTE WHICH IS USED IN BATTERY OR ELECTRIC DOUBLE LAYER CAPACITORS | SHOWA DENKO K.K. (JP) | 2001-11-13 | — | — | US | claimed |
| JP-7216007-A | — | — | None | — | — | JP | disclosed |
| CN-118338879-A | Curable composition for dental use | 可乐丽则武齿科株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-116075368-B | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2024-06-11 | — | — | CN | disclosed |
| CN-111205788-B | Anisotropic film and method for producing anisotropic film | 信越化学工业株式会社 | 2024-06-07 | — | — | CN | disclosed |
| CN-118140601-A | Resin composition, cured product, sheet, laminate, and printed wiring board | 株式会社力森诺科 | 2024-06-04 | — | — | CN | disclosed |
| CN-118063502-A | (Meth) acrylate compound, (meth) acrylate resin, curable composition, cured product, prepreg, circuit board, laminated film, and semiconductor sealing material | DIC株式会社 | 2024-05-24 | — | — | CN | disclosed |
| US-20240132645-A1 | COMPOSITION CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN AND COMPOUND HAVING POLY(METH)ACRYLATE CHAIN | RESONAC CORPORATION (JP) | 2024-04-25 | — | — | US | disclosed |
| EP-1123942-A2 | Amino-group-containing polymer (salt) and production process therefor | Nippon Shokubai Co., Ltd. (JP) | 2001-08-16 | — | — | EP | disclosed |
| US-20010012870-A1 | Composition for film formation and insulating film | JSR CORPORATION (JP) | 2001-08-09 | — | — | US | disclosed |
| EP-1122746-A1 | Composition for film formation and insulating film | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |
| EP-1099719-A1 | Diyne-containing (co) polymer, processes for producing the same, and cured film | JSR Corporation (JP) | 2001-05-16 | — | — | EP | disclosed |
| US-6165549-A | Process for producing solvent-free acrylic sheet | SOKEN CHEMICAL & ENGINEERING CO., LTD. (JP) | 2000-12-26 | — | — | US | disclosed |
| EP-1057843-A1 | Aqueous emulsion, process for producing the same and aqueous paint and aqueous printing ink comprising the same | NIPPON POLYURETHANE INDUSTRY CO. LTD. (JP) | 2000-12-06 | — | — | EP | disclosed |
| EP-0979854-A1 | CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-16 | — | — | EP | disclosed |
| JP-H07216007-A | PRODUCTION OF METHACRYLIC RESIN | KURARAY CO LTD | 1995-08-15 | — | — | JP | disclosed |