⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4277106 | 1.00 | — | — | |
| SCHEMBL28521864 | 0.89 | — | — | |
| SCHEMBL3097461 | 0.89 | — | — | |
| SCHEMBL28545098 | 0.89 | — | — | |
| SCHEMBL10643789 | 0.89 | — | — | |
| SCHEMBL29114396 | 0.87 | — | — | |
| SCHEMBL5014155 | 0.87 | — | — | |
| SCHEMBL30023599 | 0.87 | — | — | |
| SCHEMBL11172239 | 0.87 | — | — | |
| SCHEMBL4040170 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116848678-A | Redox flow cell | 舍弗勒技术股份两合公司 | 2023-10-03 | — | — | CN | claimed |
| CN-117512395-B | High-strength middle-conductive copper nickel silicon tin phosphorus alloy strip foil and preparation method thereof | 宁波兴业盛泰集团有限公司 | 2024-03-29 | — | — | CN | disclosed |
| CN-117512395-A | High-strength middle-conductive copper nickel silicon tin phosphorus alloy strip foil and preparation method thereof | 宁波兴业盛泰集团有限公司 | 2024-02-06 | — | — | CN | disclosed |
| CN-116848678-A | Redox flow cell | 舍弗勒技术股份两合公司 | 2023-10-03 | — | — | CN | disclosed |
| CN-102971383-B | Silicon-containing curable composition, cured product of the silicon-containing curable composition, and lead frame substrate formed from the silicon-containing curable composition | ADEKA CORP | 2014-11-12 | — | — | CN | disclosed |
| US-8809478-B2 | Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition | ADEKA CORPORATION (JP) | 2014-08-19 | — | — | US | disclosed |
| EP-2581417-A1 | SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICON-CONTAINING CURABLE COMPOSITION AND LEAD FRAME SUBSTRATE FORMED OF THE SILICON-CONTAINING CURABLE COMPOSITION | Adeka Corporation (JP) | 2013-04-17 | — | — | EP | disclosed |
| US-20130075154-A1 | SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICON-CONTAINING CURABLE COMPOSITION AND LEAD FRAME SUBSTRATE FORMED OF THE SILICON-CONTAINING CURABLE COMPOSITION | ADEKA CORPORATION (JP) | 2013-03-28 | — | — | US | disclosed |