⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30342073 | 1.00 | — | — | |
| SCHEMBL28677150 | 1.00 | — | — | |
| SCHEMBL4040174 | 1.00 | — | — | |
| SCHEMBL30023599 | 1.00 | — | — | |
| SCHEMBL3853667 | 0.87 | — | — | |
| SCHEMBL10690754 | 0.87 | — | — | |
| SCHEMBL4274624 | 0.87 | — | — | |
| SCHEMBL22444984 | 0.87 | — | — | |
| SCHEMBL4269610 | 0.87 | — | — | |
| SCHEMBL3853665 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 276 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119994531-A | Electrical terminal | 泰科电子连接解决方案有限责任公司 | 2025-05-13 | — | — | CN | claimed |
| CN-118957360-A | Super-pure silicon-nickel-copper alloy with high cobalt content and preparation method thereof | 中国科学院金属研究所 | 2024-11-15 | — | — | CN | claimed |
| CN-116377280-B | Copper-nickel-silicon alloy with coexisting internal multi-orientation twin crystal and precipitated phase and preparation method thereof | 河南科技大学 | 2024-10-08 | — | — | CN | claimed |
| US-20240269744-A1 | JOINED BODY AND MANUFACTURING METHOD THEREOF | NGK INSULATORS, LTD. (JP) | 2024-08-15 | — | — | US | claimed |
| CN-113186503-B | Cold binding preparation method of magnetron sputtering rotary target and target prepared by same | 广州市尤特新材料有限公司 | 2024-07-16 | — | — | CN | claimed |
| CN-118176073-A | Bonded body and method for manufacturing same | 日本碍子株式会社 | 2024-06-11 | — | — | CN | claimed |
| CN-116791082-B | Method for producing nickel cladding layer and copper substrate covered with nickel cladding layer | 天津职业技术师范大学(中国职业培训指导教师进修中心) | 2024-03-22 | — | — | CN | claimed |
| CN-117051285-B | Copper-nickel-silicon alloy, preparation method and application thereof | 中铝科学技术研究院有限公司 | 2023-12-15 | — | — | CN | claimed |
| CN-115652136-B | Free-cutting copper-nickel-silicon bar and preparation method thereof | 宁波金田铜业(集团)股份有限公司 | 2023-12-15 | — | — | CN | claimed |
| US-11843153-B2 | Use of enhanced performance ultraconductive copper materials in cylindrical configurations and methods of forming ultraconductive copper materials | TE CONNECTIVITY SOLUTIONS GMBH (CH) | 2023-12-12 | — | — | US | claimed |
| CN-112680692-A | Method for improving resistance of copper alloy to active sulfur corrosion | 米巴精密零部件（中国）有限公司 | 2021-04-20 | — | — | CN | claimed |
| CN-107632507-B | Component for a timepiece movement | 尼瓦洛克斯-法尔股份有限公司 | 2021-01-08 | — | — | CN | claimed |
| US-20200295427-A1 | USE OF ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER MATERIALS IN CYLINDRICAL CONFIGURATIONS AND METHODS OF FORMING ULTRACONDUCTIVE COPPER MATERIALS | TE CONNECTIVITY SOLUTIONS GMBH (CH) | 2020-09-17 | — | — | US | claimed |
| CN-109182795-B | Preparation method of high-strength high-conductivity rare earth copper-nickel-silicon-chromium alloy | 北京科技大学 | 2020-06-05 | — | — | CN | claimed |
| CN-108193080-B | High-strength high-conductivity stress relaxation-resistant copper-nickel-silicon alloy material and preparation method thereof | 北京有色金属研究总院 | 2019-12-17 | — | — | CN | claimed |
| US-20190218691-A1 | TEMPERATURE CONTROL BASED MEMORY TEXTILE AND WEARABLE OBJECT USING THE SAME | INTELLIGENCE TEXTILE TECHNOLOGY CO., LTD. (TW) | 2019-07-18 | — | — | US | claimed |
| EP-3511454-A1 | TEMPERATURE CONTROL BASED MEMORY TEXTILE AND WEARABLE OBJECT USING THE SAME | Intelligence Textile Technology Co., Ltd. (TW) | 2019-07-17 | — | — | EP | claimed |
| US-20190127894-A1 | ELECTRIC HEATING CLOTH HAVING GAPS AND CONNECTION STRUCTURE THEREOF | Bumblebee Tech Co., Ltd. (SC) | 2019-05-02 | — | — | US | claimed |
| CN-104561649-B | Production process of high-strength copper-nickel-silicon alloy | 江西省首诺铜业有限公司 | 2016-08-31 | — | — | CN | claimed |
| CN-104561649-A | Production process of high-strength copper-nickel-silicon alloy | JIANGXI SHOUNUO COPPER INDUSTRY CO LTD | 2015-04-29 | — | — | CN | claimed |