⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2869631 | 1.00 | — | — | |
| SCHEMBL13915428 | 1.00 | — | — | |
| SCHEMBL13915433 | 0.91 | — | — | |
| SCHEMBL14564288 | 0.87 | — | — | |
| SCHEMBL13915430 | 0.82 | — | — | |
| SCHEMBL2865969 | 0.82 | — | — | |
| SCHEMBL14564284 | 0.82 | — | — | |
| SCHEMBL2862870 | 0.79 | — | — | |
| SCHEMBL20845457 | 0.75 | — | — | |
| SCHEMBL6053267 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240361695-A1 | STRUCTURES INCLUDING A SiOCN PHOTORESIST ADHESION LAYER AND METAL-OXIDE RESIST AND METHODS OF FORMING SAME | ASM IP HOLDING B.V. (NL) | 2024-10-31 | — | — | US | claimed |
| EP-4307343-A2 | USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS | Versum Materials US, LLC (US) | 2024-01-17 | — | — | EP | claimed |
| US-20230288810-A1 | METHOD OF FORMING A STRUCTURE COMPRISING A PHOTORESIST UNDERLAYER | ASM IP HOLDING B.V. (NL) | 2023-09-14 | — | — | US | claimed |
| US-20220350248-A1 | METHOD OF FORMING AN ADHESION LAYER ON A PHOTORESIST UNDERLAYER AND STRUCTURE INCLUDING SAME | ASM IP HOLDING B.V. (NL) | 2022-11-03 | — | — | US | claimed |
| US-20180122632-A1 | USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS | VERSUM MATERIALS US, LLC | 2018-05-03 | — | — | US | claimed |
| US-20250291252-A1 | STRUCTURE INCLUDING A PHOTORESIST UNDERLAYER AND METHOD OF FORMING SAME | ASM IP HOLDING B.V. (NL) | 2025-09-18 | — | — | US | disclosed |
| US-20240377751-A1 | STRUCTURE INCLUDING SILICON GERMANIUM OXIDE PHOTORESIST UNDERLAYER AND METHOD OF FORMING SAME | ASM IP HOLDING B.V. (NL) | 2024-11-14 | — | — | US | disclosed |
| US-20240361695-A1 | STRUCTURES INCLUDING A SiOCN PHOTORESIST ADHESION LAYER AND METAL-OXIDE RESIST AND METHODS OF FORMING SAME | ASM IP HOLDING B.V. (NL) | 2024-10-31 | — | — | US | disclosed |
| EP-4307343-A2 | USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS | Versum Materials US, LLC (US) | 2024-01-17 | — | — | EP | disclosed |
| US-20230288810-A1 | METHOD OF FORMING A STRUCTURE COMPRISING A PHOTORESIST UNDERLAYER | ASM IP HOLDING B.V. (NL) | 2023-09-14 | — | — | US | disclosed |
| US-20220350248-A1 | METHOD OF FORMING AN ADHESION LAYER ON A PHOTORESIST UNDERLAYER AND STRUCTURE INCLUDING SAME | ASM IP HOLDING B.V. (NL) | 2022-11-03 | — | — | US | disclosed |
| US-10249489-B2 | Use of silyl bridged alkyl compounds for dense OSG films | VERSUM MATERIALS US, LLC (US) | 2019-04-02 | — | — | US | disclosed |
| US-8951342-B2 | Methods for using porogens for low k porous organosilica glass films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2015-02-10 | — | — | US | disclosed |
| US-20130095255-A1 | Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2013-04-18 | — | — | US | disclosed |
| US-20120282415-A1 | Methods For Using Porogens For Low K Porous Organosilica Glass Films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-11-08 | — | — | US | disclosed |
| US-20110077364-A1 | COMPOSITION CONTAINING SILICON-CONTAINING POLYMER, CURED PRODUCT OF THE COMPOSITION, SILICON-CONTAINING POLYMER, AND METHOD OF PRODUCING THE SILICON-CONTAINING POLYMER | JSR CORPORATION (JP) | 2011-03-31 | — | — | US | disclosed |
| EP-2116632-A2 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | Air Products and Chemicals, Inc. (US) | 2009-11-11 | — | — | EP | disclosed |
| US-20080268177-A1 | Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2008-10-30 | — | — | US | disclosed |
| US-20070054136-A1 | Film forming composition, insulating film and production process of the insulating film | FUJI PHOTO FILM CO., LTD. | 2007-03-08 | — | — | US | disclosed |
| US-20070036991-A1 | Film-forming composition, insulating film and production method thereof | FUJI PHOTO FILM CO., LTD. | 2007-02-15 | — | — | US | disclosed |