⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14564288 | 0.87 | — | — | |
| SCHEMBL6053267 | 0.87 | — | — | |
| SCHEMBL15157466 | 0.87 | — | — | |
| SCHEMBL2864111 | 0.86 | — | — | |
| SCHEMBL13915428 | 0.79 | — | — | |
| SCHEMBL1482876 | 0.79 | — | — | |
| SCHEMBL2869631 | 0.79 | — | — | |
| SCHEMBL2865969 | 0.76 | — | — | |
| SCHEMBL335704 | 0.71 | — | — | |
| SCHEMBL13915433 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4307343-A2 | USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS | Versum Materials US, LLC (US) | 2024-01-17 | — | — | EP | claimed |
| US-20180122632-A1 | USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS | VERSUM MATERIALS US, LLC | 2018-05-03 | — | — | US | claimed |
| EP-4307343-A2 | USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS | Versum Materials US, LLC (US) | 2024-01-17 | — | — | EP | disclosed |
| US-10249489-B2 | Use of silyl bridged alkyl compounds for dense OSG films | VERSUM MATERIALS US, LLC (US) | 2019-04-02 | — | — | US | disclosed |
| US-20180122632-A1 | USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS | VERSUM MATERIALS US, LLC | 2018-05-03 | — | — | US | disclosed |
| EP-2154708-B1 | High-temperature bonding composition, substrate bonding method, and 3-D semiconductor device | SHINETSU CHEMICAL CO (JP) | 2017-07-26 | — | — | EP | disclosed |
| US-8277600-B2 | High-temperature bonding composition, substrate bonding method, and 3-D semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-10-02 | — | — | US | disclosed |
| US-20100040895-A1 | HIGH-TEMPERATURE BONDING COMPOSITION, SUBSTRATE BONDING METHOD, AND 3-D SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-02-18 | — | — | US | disclosed |
| EP-2154708-A1 | High-temperature bonding composition, substrate bonding method, and 3-D semiconductor device | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-02-17 | — | — | EP | disclosed |
| US-7497965-B2 | Insulating film-forming composition, insulating film and production method thereof | FUJIFILM CORPORATION (JP) | 2009-03-03 | — | — | US | disclosed |
| US-20070034992-A1 | Insulating film-forming composition, insulating film and production method thereof | FUJI PHOTO FILM CO., LTD. | 2007-02-15 | — | — | US | disclosed |