Phosphonic Acid

Phosphonic Acid

SCHEMBL1483549

O=[PH]([O-])[O-].[Fe+2]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118718757-A Composite membrane for actinium-containing wastewater treatment and preparation method thereof 中国工程物理研究院核物理与化学研究所 2024-10-01 CN claimed
CN-118056569-A Nucleic acid-based cGAS-STING immunoadjuvant, preparation method and application thereof 苏州大学 2024-05-21 CN claimed
US-9543574-B2 Process for producing electrode materials BASF SE (DE) 2017-01-10 US claimed
EP-2850681-B1 METHOD FOR MANUFACTURING ELECTRODE MATERIALS BASF SE (DE) 2016-08-03 EP claimed
US-20150118560-A1 PROCESS FOR PRODUCING ELECTRODE MATERIALS BASF SE (DE) 2015-04-30 US claimed
WO-2014004817-A2 PROCESSES AND COMPOSITIONS FOR MULTI-TRANSITION METALCONTAINING CATHODE MATERIALS USING MOLECULAR PRECURSORS PRECURSOR ENERGETICS, INC. (US) 2014-01-03 WO claimed
US-20120205594-A1 ELECTRODE MATERIALS AND PROCESS FOR PRODUCING THEM BASF SE (DE) 2012-08-16 US claimed
US-20080029126-A1 Compositions and methods for improved planarization of copper utilizing inorganic oxide abrasive ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2008-02-07 US claimed
WO-2007017900-A2 PREPARATION OF PARA DICHLOROBENZENE FROM BENZENE OR MONO CHLOROBENZENE MANDAL SISIR KUMAR (IN) 2007-02-15 WO claimed
US-6971945-B2 Multi-step polishing solution for chemical mechanical planarization ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2005-12-06 US claimed
US-20050194357-A1 MULTI-STEP POLISHING SOLUTION FOR CHEMICAL MECHANICAL PLANARIZATION ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2005-09-08 US claimed
EP-1548076-A1 Compositions and methods for low downforce pressure polishing of copper Rohm and Haas Electronic Materials CMP Holdings, Inc. (US) 2005-06-29 EP claimed
US-20050136671-A1 Compositions and methods for low downforce pressure polishing of copper ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2005-06-23 US claimed
US-12202977-B2 Rubber composition and tire BRIDGESTONE CORPORATION (JP) 2025-01-21 US disclosed
CN-118755517-A Water-based efficient antirust lubricating composition, and preparation method and application thereof 东莞市颖兴金属表面处理材料有限公司 2024-10-11 CN disclosed
CN-118718757-A Composite membrane for actinium-containing wastewater treatment and preparation method thereof 中国工程物理研究院核物理与化学研究所 2024-10-01 CN disclosed
US-5529125-A USING A PHOSPHONATE COMPOUND B. J. SERVICES COMPANY (US) 1996-06-25 US disclosed
EP-0313335-B1 Rust removal and composition therefor GRACE DEARBORN INC (CA) 1993-12-15 EP disclosed
EP-0313335-A1 Rust removal and composition therefor GRACE DEARBORN INC. (CA) 1989-04-26 EP disclosed
US-4810405-A CHELATION DEARBORN CHEMICAL COMPANY, LIMITED (CA) 1989-03-07 US disclosed