SCHEMBL14838099

SCHEMBL14838099

C=Cc1ccc(OC(=O)COc2ccc(S(=O)(=O)O)cc2)cc1

nearest known ligand 0.58

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
▸ TDP1 Q9NUW8 2/20 0.58
▸ GAA P10253 3/20 0.47
▸ NPSR1 Q6W5P4 2/20 0.47
▸ SMN1; SMN2 Q16637 1/20 0.46
▸ LMNA P02545 1/20 0.44
▸ ALDH1A1 P00352 2/20 0.42
▸ ATM Q13315 1/20 0.40
▸ NPC1 O15118 1/20 0.40
▸ L3MBTL1 Q9Y468 1/20 0.40
▸ CYP2C9 P11712 1/20 0.39
▸ CYP2C19 P33261 1/20 0.39
▸ POLB P06746 1/20 0.39
▸ PTGS2 P35354 2/20 0.39
▸ KMT2A Q03164 1/20 0.38
▸ MAPT P10636 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8864820 0.82 ALDH1A1 (0.50) GAANPSR1SMN1; SMN2LMNAALDH1A1
SCHEMBL16590875 0.82 TDP1 (0.70) TDP1SMN1; SMN2LMNAALDH1A1NPC1
SCHEMBL16590879 0.81 TDP1 (0.68) TDP1SMN1; SMN2LMNAALDH1A1NPC1
SCHEMBL16590883 0.81 TDP1 (0.68) TDP1SMN1; SMN2LMNAALDH1A1NPC1
SCHEMBL16590876 0.80 TDP1 (0.66) TDP1GAASMN1; SMN2LMNAALDH1A1
SCHEMBL16590877 0.80 TDP1 (0.66) TDP1GAASMN1; SMN2LMNAALDH1A1
SCHEMBL2742185 0.78 TDP1 (0.64) TDP1SMN1; SMN2NPC1
SCHEMBL2742174 0.78 TDP1 (0.38) TDP1GAANPSR1SMN1; SMN2LMNA
SCHEMBL16683037 0.77 TDP1 (0.78) TDP1GAASMN1; SMN2LMNAALDH1A1
SCHEMBL16590863 0.77 TDP1 (0.78) TDP1GAASMN1; SMN2LMNAALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2013047895-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND PATTERN FORMING METHOD EACH USING THE COMPOSITION, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND PRODUCTION METHOD OF RESIN FUJIFILM CORPORATION (JP) 2013-04-04 — — WO disclosed
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