⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15241855 | 0.83 | — | — | |
| SCHEMBL16984449 | 0.83 | — | — | |
| SCHEMBL15151260 | 0.81 | — | — | |
| SCHEMBL15580428 | 0.79 | — | — | |
| SCHEMBL16901603 | 0.75 | — | — | |
| SCHEMBL15028877 | 0.74 | — | — | |
| SCHEMBL16656614 | 0.74 | — | — | |
| SCHEMBL15028833 | 0.74 | — | — | |
| SCHEMBL15062043 | 0.73 | — | — | |
| SCHEMBL15095782 | 0.73 | TSHR (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2603535-B1 | ELECTRICALLY INSULATING VARNISHES PREPARED FROM MODIFIED POLYMERS AND ELECTRICAL CONDUCTORS HAVING IMPROVED LUBRICITY PREPARED THEREFROM | SCHWERING & HASSE ELEKTRODRAHT GMBH (DE) | 2017-01-25 | — | — | EP | disclosed |
| US-8735264-B2 | Temporary adhesive composition and method for manufacturing thin wafer using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-05-27 | — | — | US | disclosed |
| EP-2615124-A1 | Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-07-17 | — | — | EP | disclosed |
| EP-2602279-A1 | Silicone-modified wax, composition and cosmetic preparation containing the same, and production method of silicone-modified wax | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-06-12 | — | — | EP | disclosed |
| US-20130089967-A1 | TEMPORARY ADHESIVE COMPOSITION AND METHOD FOR MANUFACTURING THIN WAFER USING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-04-11 | — | — | US | disclosed |